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3DXP Product Engineer - Reliability

Date: Mar 11, 2019

Location: Boise, ID, US

Company: Micron


Req. ID: 123190 

As an 3DxP Product Engineer at Micron Technology, Inc, you will be responsible for developing and maintaining reliability testing for Micron’s leading edge next generation non-volatile memory devices.  You will develop test code and perform failure analysis and data analysis to ensure Micron’s devices meet all internal and external qualification requirements.  The tests you develop will provide critical reliability data and characterization to engineering teams throughout the company. 

Responsibilities and Tasks

  • Responsible for reliability test and test flow development
  • Define and improve testing methods to address new product characterization and qualification issues on devices manufactured at Micron’s R&D facility
  • Summarize and interpret test results in terms of component reliability characteristics.
  • Perform device characterization and support electrical failure analysis (EFA)
  • Design, develop, test/debug, document, and deploy software applications
  • Conduct system software and hardware requirements and readiness reviews
  • Define interface hardware specifications and perform validation and debug of new interface boards



  • Excellent knowledge and experience with programming in a component test environment.
  • Thorough understanding of interpreted scripting languages like Python or Perl.
  • Good knowledge and experience with database applications (SQL, Hadoop).
  • Understanding on High performance computing concepts.
  • Good understanding and experience with Unix/Linux operating systems.
  • Knowledge of non-volatile memory architecture and operation (NAND, NOR, etc).
  • Knowledge of statistical methods commonly used in component qualification.
  • Experience with Data Analysis Tools such as JMP or Tableau.
  • Strong problem solving and analytical skills.
  • Effective communication and presentation skills.
  • Excellent organizational skills.
  • Self-motivated and enthusiastic.
  • Demonstrated ability to partner successfully with other groups to build strong peer relationships and meet customers’ needs.


  • Position requires a minimum of a Bachelor's degree in Electrical or Computer Engineering.
  • Course work in VLSI, semiconductor process, and C/C++. 


  • Successful candidates would have 3+ year experience in semiconductor reliability and qualification.

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Boise || Idaho (US-ID) || United States (US) || DEG (DRAM Engineering Group) || College || Regular || Engineering || Not Applicable ||

Nearest Major Market: Boise
Nearest Secondary Market: Meridian

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