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3DXP Cell Device and Array Engineer

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Date: Mar 11, 2019

Location: Boise, ID, US

Company: Micron


Req. ID: 123189 

As a 3DxP Cell Device and Array Engineer in the Product Engineering group at Micron Technology Inc., you will be responsible for analyzing and characterizing the cell performance and optimizing array operations for next generation innovative 3D Cross Point technologies to meet product requirements within project timelines.

 Responsibilities and Tasks

  • Work on optimization and improvement of the read window budget (RWB): characterize 3DxP cell array, understand trims, assess benefits of circuit features, propose optimized array algorithms, and influence the development of new features in collaboration with other PE and Design teams
  • Contribute to the cell improvement effort (performance, reliability) by providing feedback to the Process Integration and Cell Engineers on process experiments and their possible interactions with periphery and array architectures and operations
  • Be the 3DxP cell device physics and 3DxP array operations expert within PE, able to relate cell/array capability with device performance and reliability requirements
  • Spearhead array failure mode and effect analysis (FMEA) efforts, including hands-on electrical failure analysis (EFA), driving cross-functional teams to address device and array deficiencies
  • Support the qualification of the technology as needed.
  • Update team and management as to the status of the projects.


  • A strong understanding of semiconductor devices and processes, non-volatile memory device architectures and operations, and statistics.
  • Programming acumen relevant to characterizing cell/array properties and developing appropriate algorithms for optimized performance of the same. Typical platforms/languages used: JMP, MATLAB, PERL, PYTHON.
  • Solid communication and reporting abilities.
  • The ability to be highly skilled at arriving at timely, relevant and accurate results. 
  • Must possess integrity and initiative


MS or BS in Electrical or Computer Engineering.



The ideal candidate will have 5+ years of relevant experience in device characterization.



We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Boise || Idaho (US-ID) || United States (US) || DEG (DRAM Engineering Group) || College || Regular || Engineering || Not Applicable ||

Nearest Major Market: Boise
Nearest Secondary Market: Meridian

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