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Assembly Equipment Engineer - Wire Bond

Batu kawan, 07, MY

Micron’s vision is to transform how the world uses information to enrich life for all.  Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. 

 

Req. ID: 272701 

 

As a Wire Bond Equipment Engineer, you will be oversees the installation, modification, upgrade and maintenance of manufacturing equipment including studies equipment performance and reliability to ensure production equipment is in control and quality of product is meeting expectation; sustaining and improving key performance indices of the equipment through continuous improvement activities; reducing cost through qualifying 2nd source; ensuring effective and efficient equipment risk management strategy; continuous develop new capabilities ahead of needs.

 

 

Responsibilities and Tasks:

  • Implement Preventive/Predictive maintenance program
  • Develop equipment maintenance specification
  • Monitor equipment performance key indicators and responsible to meet expectation
  • Provide necessary production support
  • Establish spare inventory system for key equipment
  • Monitor spare cost and drive down liabilities of spare inventories
  • Work with Purchasing to identify critical suppliers and develop 2nd sourcing strategy
  • Identify the key cost drivers and work on cost reduction programs
  • Define, develop and maintain equipment capabilities, strategy and roadmap
  • Maintaining a matrix on equipment capabilities and constraints
  • Work with equipment suppliers to develop new material / capabilities
  • Regularly conduct equipment benchmarking exercise
  • Work with equipment suppliers to develop new capability
  • Work with Package Development team to establish production capabilities for new products

Requirements:

  • Master / Degree in Mechanical, Mechatronics, Electrical & Electronics or related Engineering
  • Minimum 3 years of working experience in semiconductor industry.
  • Knowledge in Wire Bond, Plasma Cleaning will be added advantages.
  • Excellent interpersonal, communication and leadership skill with an extremely positive attitude towards working as a team.
  • Broad technical knowledge in problem solving analytical skill & lead an engineering team through innovative process implementation (FMEA, DOE, FDC/APC, DATA ANALYSIS)
  • Self-motivated, possess initiative and ability to work independently
  • Team player with good communication and interpersonal skills


This Notice is being provided as a result of the filing of an application for permanent alien labor certification for this job opportunity.  Any person may provide documentary evidence bearing on the application to:


Certifying Officer
U.S. Department of Labor
Employment and Training Administration
Harris Tower
233 Peachtree Street, Suite 410
Atlanta, Georgia 30303
 

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