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Productization Engineer

Batu Kawan, 07, MY

 

Req. ID: 156181 

 

An Productization Engineer is responsible for transfer, successful qualification and ramp to HVM on time of Micron memory packages (NVM). The Productization Engineer is responsible to meet the project milestone and meet the assembly, test and reliability requirement of the package. He/She must interface with package design team, define/develop BOM and process flow, a point of contact with the Product Engineering Group, Quality and Reliability Group, Test and Post Electrical group as well as the External Manufacturing Engineering. He/She will act as project manager of the product he owns, prepare specs, engineering instruction, assembly reports that are required for product release and qualifications.

 

Responsibility:

The responsibilities of the Productization Engineer include and not limited to the following:

  • Defining the Build of Material (BOM) for all packaging level products.
  • Ensure Engineering samples and qualification samples are on time and achieve 1st time successful product qualification release.
  • Ensure products meet yield / quality / reliability expectations.
  • Maintain a matrix of key performance indices and drive improvement through team-based continuous improvement activities / projects.
  • Leverage knowledge of experts across functions to successfully launch new technologies in packaging.
  • Use structured problem-solving techniques and lead team problem solving efforts.
  • Identify projects, coordinate and evaluate controlled experiments. Know how to validate experimental data and make data driven decisions.
  • Communicate product and project information to departments outside of Assembly.
  • Act as the point of contact for product/project related issues.
  • Work closely with Global Product Engineer counterpart to ensure consistency across the network.
  • Act as a point of contact for Quality and Reliability Assurance (QRA) on returned merchandise (RMA).
  • Support process improvements (die and package).
  • Work across global internal and external manufacturing sites to drive product quality through BKM sharing and alignment programs
  • Communicate product and project information to departments outside of Assembly
  • Enlist the support of management
  • Send weekly product/project team updates to team members and management team
  • Act as the point of contact for product/project related issues
  • Prepare Change Control Documents and present the change to Change Control Board (CCB)
  • Be able to apply MSSR (Mean Shift/Sigma Ratio) for Site Equivalency.
     

Education:

  • Minimum must have bachelor’s degree in Engineering from a recognized university or related field equivalent technical work experience.

 

Experience:

  • highly motivated individuals with at least 5 years' working experience are encouraging to apply.
  • Good understanding of Assembly processes preferred.
  • Understanding of the interaction Assembly Process and Materials (substrate, mold compound, silicon) specifically for Package Warpage is preferred.
  • Electrical and Mechanical and Material Science knowledge will be an added advantage.
  • Statistical and DOE skills is preferred

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form


Keywords:  Batu Kawan || Pulau Pinang (MY-07) || Malaysia (MY) || Technology Development || Experienced || Regular || Engineering || #LI-MP3 || Tier 4 || 

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