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Assembly Equipment Technician - Die Attach & Wire Bond

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Date: Jun 19, 2019

Location: Batu Kawan, 07, MY

Company: Micron

 

Req. ID: 134219 

Performs electrical or mechanical troubleshooting to determine equipment problems in manufacturing process. Dismantles, adjusts, repairs and assembles equipment according to layout plans, blueprints, operating or repair manuals. Perform equipment modifications as directed by engineers. Perform periodic basic equipment preventive/predictive maintenance & Perform daily/weekly equipment critical parameters inspection. Ensure zero defect products by ensuring proper equipment setup & buyoff 

 

Responsibilities and Tasks:

  • Bring up equipment in an efficient manner and minimum downtime

  • Operate and maintain equipment

  • Apply problem solving technique by available tools and resources to solve problem

  • Perform routine equipment health check / conversion as defined

 

Requirements:

  • Diploma in Mechanical, Mechatronics, Electrical & Electronics

  • Good communication and interpersonal skills with a strong interest in working in a dynamic environment

  • Knowledge in Die Attach and Wire Bond with 3 years experience in Semiconductor Manufacturing will be added advantages.

  • Strong Performer, Fast Learner, independent and highly motivated

Capability of analyzing data and problem solving

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form


Keywords:  Batu Kawan || Pulau Pinang (MY-07) || Malaysia (MY) || Backend Manufacturing || Experienced || Regular || Engineering || || Tier 3 || 


Job Segment: Assembly, Semiconductor, Technician, Engineer, Maintenance, Manufacturing, Science, Technology, Engineering