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Principal Engineer,NVE SSD PE 3DXPoint

Date: Jun 9, 2019

Location: Bangalore, KA, IN

Company: Micron

Relocation Level: Domestic 

Hiring Manager: Satish Yanamanamanda 




  • Define and develop high quality and cost efficient 3DXpoint SSD test strategies
  • Understand 3D XPoint defect mechanisms and system error recovery features
  • Collaborate with system design and eco system teams to develop PCIe production system test suites
  • Support manufacturing firmware development
  • Closely work with test hardware and test engineering teams to define and secure necessary test fixtures for memory and system testing
  • Coordinate High Volume Manufacturing yield enhancement, DPM management and TTR efforts
  • Provide technical training and expertise
  • Routinely communicate overall product status to leadership and cross functional product team
  • Provide guidance through debug and resolution of product related issues

     Successful candidates for this exciting opportunity will have:

  • A Master’s Degree in Electrical and Computer or related
  • 8+ years of experience as a Product Engineer
  • Understanding of storage interfaces including PCIe/NVMe, SATA
  • Experience with non-volatile memory technologies like 3D Xpoint and NAND
  • Experience in manufacturing firmware development for SSD’s
  • Effective communication skills in written and spoken English
  • Good multitasking and organizational skills, able to make decisions in complex situations
  • Ability to delegate tasks and set priorities in a team environment
  • Experience working in a sophisticated technology company
  • Excellent problem solving and analytical skills
  • Strong presentation skills
  • Self-motivation and enthusiasm

At Micron, we transform how the world uses information to enrich life. The pace is fast, collaboration occurs on a regular basis, and innovation is expected. As a Principal Engineer of NVE 3DXPoint SSD Product Engineering (PE) at Micron Technology, Inc., you will work with brilliant team of engineers to solve complex problems. A successful candidate in this role will be responsible to enable the New Product Introduction by closely working with the cross functional teams such as 3DXPoint device, ASIC and FW teams and assist Qualification and Ramping of cutting edge SSD products. In this role, the candidate will also define training requirements for new engineers, deliver instruction, and assist with data analysis and project management as needed. 

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