Technology Development Jobs

Join one of the world's most innovative providers of advanced semiconductor solutions. Micron combines the brightest and most passionate minds in the business with the world’s broadest memory portfolio, creating technology that leading global brands use to make computing faster, travel safer, healthcare more effective, and much more.

Your innovation. Our Memory.

As Micron looks to grow its technology leadership, the R&D group will lead the charge. No two days are the same in R&D, as our engineers are challenged to move beyond “what can’t be done” to make the most innovative semiconductor products available. Whether it’s a quick drawing on a piece of paper or even on a napkin in the cafeteria, these off-the-cuff ideas can turn from sketches, into patents, prototypes, and even a new technology that changes the industry.

If you want a career that offers personal satisfaction, global collaborative communities, and the opportunity for advancement, consider a job with Micron’s R&D team.

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SR. ENGINEER, PFA
SR. ENGINEER, PFA Taichung City, TXG, TW Mar 20, 2019
Taichung City, TXG, TW Mar 20, 2019
SR ENGINEER, 3DIC PACKAGE RELIABILITY
SR ENGINEER, 3DIC PACKAGE RELIABILITY Taichung City, TXG, TW Mar 20, 2019
Taichung City, TXG, TW Mar 20, 2019
ENGINEER, PACKAGE EFA
ENGINEER, PACKAGE EFA Taichung City, TXG, TW Mar 20, 2019
Taichung City, TXG, TW Mar 20, 2019
Sr. ENGINEER, CMP
Sr. ENGINEER, CMP Taichung, TXG, TW Mar 19, 2019
Taichung, TXG, TW Mar 19, 2019
Package Integration Engineer - Technology Development
Package Integration Engineer - Technology Development Taichung City, TXG, TW Mar 19, 2019
Taichung City, TXG, TW Mar 19, 2019
Senior Integration Modeling and Analytics Engineer Boise, ID, US Mar 19, 2019
Package Development Manager - NPI
Package Development Manager - NPI Taichung City, TXG, TW Mar 18, 2019
Taichung City, TXG, TW Mar 18, 2019
ENGINEER-PACKAGE LAYOUT DESIGN
ENGINEER-PACKAGE LAYOUT DESIGN Taichung City, TXG, TW Mar 18, 2019
Taichung City, TXG, TW Mar 18, 2019
IT LEAD, SOFTWARE SERVICES
IT LEAD, SOFTWARE SERVICES Taichung, TXG, TW Mar 18, 2019
Taichung, TXG, TW Mar 18, 2019
Intern - Process Integration Engineering
Intern - Process Integration Engineering Boise, ID, US Mar 18, 2019
Boise, ID, US Mar 18, 2019
Package Design Engineer
Package Design Engineer Boise, ID, US Mar 18, 2019
Boise, ID, US Mar 18, 2019
Data Engineer - Technology Development
Data Engineer - Technology Development Boise, ID, US Mar 18, 2019
Boise, ID, US Mar 18, 2019
Campus_R&D Process Development Engineer
Campus_R&D Process Development Engineer Hiroshima, 34, JP Mar 17, 2019
Hiroshima, 34, JP Mar 17, 2019
Japan Technology Center (JTC) Principal Process Integration Engineer Higashihiroshima, 34, JP Mar 17, 2019
Japan Technology Center (JTC) Principal Process Integration Engineer Higashihiroshima, 34, JP Mar 17, 2019
Campus_Design Verification Engineer-DRAM R&D in Kanagawa, Japan Hashimoto, 14, JP Mar 17, 2019
ENGINEER PACKAGING INTEGRATION
ENGINEER PACKAGING INTEGRATION Taichung City, TXG, TW Mar 16, 2019
Taichung City, TXG, TW Mar 16, 2019
R&D Group - Patterning Solutions Technologist Boise, ID, US Mar 16, 2019
3D XPoint Principal YE Engineer-Lehi Tech Center Lehi, UT, US Mar 16, 2019
APD Singapore PCVD Process and Equipment Development Sr Engineer Singapore, 02, SG Mar 16, 2019
IT Systems Administrator
IT Systems Administrator Manassas, VA, US Mar 16, 2019
Manassas, VA, US Mar 16, 2019
STC NAND Senior Integrated Fail Mode Analysis Engineer SINGAPORE, 03, SG Mar 16, 2019
IT Network Engineer
IT Network Engineer Hyderabad, AP, IN Mar 16, 2019
Hyderabad, AP, IN Mar 16, 2019
Environmental Engineer
Environmental Engineer Boise, ID, US Mar 16, 2019
Boise, ID, US Mar 16, 2019
Technician- APTD CHARACTERIZATION 1
Technician- APTD CHARACTERIZATION 1 Taichung City, TXG, TW Mar 16, 2019
Taichung City, TXG, TW Mar 16, 2019