Technology Development Jobs

Join one of the world's most innovative providers of advanced semiconductor solutions. Micron combines the brightest and most passionate minds in the business with the world’s broadest memory portfolio, creating technology that leading global brands use to make computing faster, travel safer, healthcare more effective, and much more.

Your innovation. Our Memory.

As Micron looks to grow its technology leadership, the R&D group will lead the charge. No two days are the same in R&D, as our engineers are challenged to move beyond “what can’t be done” to make the most innovative semiconductor products available. Whether it’s a quick drawing on a piece of paper or even on a napkin in the cafeteria, these off-the-cuff ideas can turn from sketches, into patents, prototypes, and even a new technology that changes the industry.

If you want a career that offers personal satisfaction, global collaborative communities, and the opportunity for advancement, consider a job with Micron’s R&D team.

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SR ENGINEER, 3DIC PACKAGE RELIABILITY
SR ENGINEER, 3DIC PACKAGE RELIABILITY Taichung City, TXG, TW Jan 21, 2019
Taichung City, TXG, TW Jan 21, 2019
SR. ENGINEER, PFA
SR. ENGINEER, PFA Taichung City, TXG, TW Jan 21, 2019
Taichung City, TXG, TW Jan 21, 2019
SR. ENGINEER, PACKAGE EFA
SR. ENGINEER, PACKAGE EFA Taichung City, TXG, TW Jan 21, 2019
Taichung City, TXG, TW Jan 21, 2019
Intern - Technology Development Engineer
Intern - Technology Development Engineer Boise, ID, US Jan 20, 2019
Boise, ID, US Jan 20, 2019
Package Integration Engineer - Technology Development
Package Integration Engineer - Technology Development Taichung City, TXG, TW Jan 20, 2019
Taichung City, TXG, TW Jan 20, 2019
APTD Package Product Development Manager 1
APTD Package Product Development Manager 1 Boise, ID, US Jan 20, 2019
Boise, ID, US Jan 20, 2019
Package Design Engineer
Package Design Engineer Boise, ID, US Jan 19, 2019
Boise, ID, US Jan 19, 2019
Package Development Manager - NPI
Package Development Manager - NPI Taichung City, TXG, TW Jan 19, 2019
Taichung City, TXG, TW Jan 19, 2019
Intern - NAND Memory Cell
Intern - NAND Memory Cell Boise, ID, US Jan 19, 2019
Boise, ID, US Jan 19, 2019
IT LEAD, SOFTWARE SERVICES
IT LEAD, SOFTWARE SERVICES Taichung, TXG, TW Jan 19, 2019
Taichung, TXG, TW Jan 19, 2019
Intern - Process Integration Engineering
Intern - Process Integration Engineering Boise, ID, US Jan 19, 2019
Boise, ID, US Jan 19, 2019
Intern - DRAM Program Manager
Intern - DRAM Program Manager Boise, ID, US Jan 19, 2019
Boise, ID, US Jan 19, 2019
Engineer - Diffusion Process
Engineer - Diffusion Process Boise, ID, US Jan 19, 2019
Boise, ID, US Jan 19, 2019
Instrumentation Technician
Instrumentation Technician Boise, ID, US Jan 19, 2019
Boise, ID, US Jan 19, 2019
ENGINEER-PACKAGE LAYOUT DESIGN
ENGINEER-PACKAGE LAYOUT DESIGN Taichung City, TXG, TW Jan 19, 2019
Taichung City, TXG, TW Jan 19, 2019
Senior Thin Film Development Engineer
Senior Thin Film Development Engineer Boise, ID, US Jan 19, 2019
Boise, ID, US Jan 19, 2019
Intern - Thin Films Process Development Engineering Boise, ID, US Jan 19, 2019
Campus_R&D Process Development Engineer
Campus_R&D Process Development Engineer Hiroshima, 34, JP Jan 18, 2019
Hiroshima, 34, JP Jan 18, 2019
Intern - JR Cell Engineer
Intern - JR Cell Engineer Boise, ID, US Jan 18, 2019
Boise, ID, US Jan 18, 2019
Campus_Design Verification Engineer-DRAM R&D in Kanagawa, Japan Hashimoto, 14, JP Jan 18, 2019
Principal R&D DRAM Process Integration Engineer BOISE, ID, US Jan 18, 2019
R&D Vapor & Plasma Etch Process Development Engineer Boise, ID, US Jan 17, 2019
STC NAND Senior Integrated Fail Mode Analysis Engineer SINGAPORE, 03, SG Jan 17, 2019
R&D Group - Patterning Solutions Technologist Boise, ID, US Jan 17, 2019
IT Network Engineer
IT Network Engineer Hyderabad, AP, IN Jan 17, 2019
Hyderabad, AP, IN Jan 17, 2019