Semiconductor Jobs at Micron

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Transforming what’s possible. Inventing beyond what can’t be done. From silicon to systems, smartphones to servers, we challenge ourselves to advance computing, networking, and mobile products to new levels—reinventing industries as a result. The reason? Innovation is a value that sits at the very core of our business strategy and drives everything we do—from patents for new product designs to the process advancements that have made us a leading-edge semiconductor manufacturer. In fact, you likely use our memory every day in products ranging from computers, mobile devices, and servers, to automobiles and more.

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System Architect
System Architect San Jose, CA, US May 3, 2021
San Jose, CA, US May 3, 2021
Equipment Maintenance Technician
Equipment Maintenance Technician Manassas, VA, US May 3, 2021
Manassas, VA, US May 3, 2021
Principal Architect
Principal Architect Austin, TX, US May 3, 2021
Austin, TX, US May 3, 2021
Technical Recruiter
Technical Recruiter Manassas, VA, US May 2, 2021
Manassas, VA, US May 2, 2021
Emerging Memory Cell Engineer
Emerging Memory Cell Engineer Boise, ID, US May 2, 2021
Boise, ID, US May 2, 2021
DRAM Product Engineer
DRAM Product Engineer Taichung, TXG, TW May 2, 2021
Taichung, TXG, TW May 2, 2021
Physical Failure Analysis Technician
Physical Failure Analysis Technician Batu Kawan, 07, MY May 2, 2021
Batu Kawan, 07, MY May 2, 2021
Contamination Control Technologist
Contamination Control Technologist Singapore, 03, SG May 2, 2021
Singapore, 03, SG May 2, 2021
PDE Data Analyst
PDE Data Analyst Taichung, TXG, TW May 2, 2021
Taichung, TXG, TW May 2, 2021
REGIONAL SALES ACCOUNT MANAGER
REGIONAL SALES ACCOUNT MANAGER Shenzhen, 44, CN May 2, 2021
Shenzhen, 44, CN May 2, 2021
PEE3 PCVD Intern
PEE3 PCVD Intern SINGAPORE, 02, SG May 2, 2021
SINGAPORE, 02, SG May 2, 2021
ENGINEER, PACKAGE CHARACTERIZATION
ENGINEER, PACKAGE CHARACTERIZATION Taichung, TXG, TW May 2, 2021
Taichung, TXG, TW May 2, 2021
Business Analyst- IAM
Business Analyst- IAM Hyderabad, TG, IN May 2, 2021
Hyderabad, TG, IN May 2, 2021
Principal Engineer, Product Quality and Reliability, High-Performance DRAM Boise, ID, US May 2, 2021
IT FIELD SERVICE TECHNOLOGIST 1 1
IT FIELD SERVICE TECHNOLOGIST 1 1 Singapore, 01, SG May 2, 2021
Singapore, 01, SG May 2, 2021
Product Development-Central Snr/Equipment Engineer: Die Preparation (Wafer grinding, Dicing) Taichung, TXG, TW May 2, 2021
Taiwan Technology Center Photolithography Process Development Engineer - Overlay Taichung, TXG, TW May 2, 2021
Engineer, Package RDA
Engineer, Package RDA Taichung, TXG, TW May 2, 2021
Taichung, TXG, TW May 2, 2021
Customer Systems Technician
Customer Systems Technician Munich, BY, DE May 2, 2021
Munich, BY, DE May 2, 2021
Taiwan Technology Center Dry Etch Process Development Engineer Taichung, TXG, TW May 2, 2021
ENGINEER/ SENIOR ENGINEER - FAC CHEM & GAS
ENGINEER/ SENIOR ENGINEER - FAC CHEM & GAS Singapore, 03, SG May 2, 2021
Singapore, 03, SG May 2, 2021
Taiwan Technology Center Thin Film Process Development Engineer Taichung, TXG, TW May 2, 2021
DRAM Product Engineer - Module DFT
DRAM Product Engineer - Module DFT Taichung City, TXG, TW May 2, 2021
Taichung City, TXG, TW May 2, 2021
Taiwan Technology Center CMP Process Development Engineer Taichung, TXG, TW May 2, 2021
Sr. Recruiter
Sr. Recruiter Xi'an, 61, CN May 2, 2021
Xi'an, 61, CN May 2, 2021