Pekerjaan Pembangunan Teknologi

Sertai salah satu penyedia penyelesaian semikonduktor maju paling inovatif di dunia. Micron menggabungkan minda paling pintar dalam perniagaan dengan portfolio memori paling lebar di dunia, mencipta teknologi yang digunakan oleh jenama global peneraju untuk menjadikan pengkomputeran lebih pantas, perjalanan lebih selamat, penjagaan kesihatan lebih berkesan dan banyak lagi.

Inovasi Anda. Memori Kami.

Memandangkan Micron mahu memperkembangkan kepimpinan teknologi, kumpulan Pembangunan Teknologi akan menerajui usaha itu. Tiada dua hari adalah sama dalam Pembangunan Teknologi, jurutera kami dicabar untuk bertindak di luar "apa yang tidak boleh dilakukan" demi menghasilkan produk semikonduktor yang paling inovatif. Sama ada ia adalah lukisan pantas di sekeping kertas atau pada tisu di kafeteria, idea-idea spontan ini boleh bertukar daripada lakaran, kepada paten, prototaip, mahupun teknologi baru yang mengubah industri.

Jika anda menginginkan kerjaya yang menawarkan kepuasan peribadi , kerjasama antara masyarakat global, dan peluang untuk kemajuan , pertimbangkan pekerjaan dengan pasukan Pembangunan Teknologi Micron .

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SR. ENGINEER, PFA
SR. ENGINEER, PFA Taichung City, TXG, TW 20 Mac 2019
Taichung City, TXG, TW 20 Mac 2019
SR ENGINEER, 3DIC PACKAGE RELIABILITY
SR ENGINEER, 3DIC PACKAGE RELIABILITY Taichung City, TXG, TW 20 Mac 2019
Taichung City, TXG, TW 20 Mac 2019
ENGINEER, PACKAGE EFA
ENGINEER, PACKAGE EFA Taichung City, TXG, TW 20 Mac 2019
Taichung City, TXG, TW 20 Mac 2019
Sr. ENGINEER, CMP
Sr. ENGINEER, CMP Taichung, TXG, TW 19 Mac 2019
Taichung, TXG, TW 19 Mac 2019
Package Integration Engineer - Technology Development
Package Integration Engineer - Technology Development Taichung City, TXG, TW 19 Mac 2019
Taichung City, TXG, TW 19 Mac 2019
Senior Integration Modeling and Analytics Engineer Boise, ID, US 19 Mac 2019
Package Development Manager - NPI
Package Development Manager - NPI Taichung City, TXG, TW 18 Mac 2019
Taichung City, TXG, TW 18 Mac 2019
ENGINEER-PACKAGE LAYOUT DESIGN
ENGINEER-PACKAGE LAYOUT DESIGN Taichung City, TXG, TW 18 Mac 2019
Taichung City, TXG, TW 18 Mac 2019
IT LEAD, SOFTWARE SERVICES
IT LEAD, SOFTWARE SERVICES Taichung, TXG, TW 18 Mac 2019
Taichung, TXG, TW 18 Mac 2019
Intern - Process Integration Engineering
Intern - Process Integration Engineering Boise, ID, US 18 Mac 2019
Boise, ID, US 18 Mac 2019
Package Design Engineer
Package Design Engineer Boise, ID, US 18 Mac 2019
Boise, ID, US 18 Mac 2019
Data Engineer - Technology Development
Data Engineer - Technology Development Boise, ID, US 18 Mac 2019
Boise, ID, US 18 Mac 2019
Campus_R&D Process Development Engineer
Campus_R&D Process Development Engineer Hiroshima, 34, JP 17 Mac 2019
Hiroshima, 34, JP 17 Mac 2019
Japan Technology Center (JTC) Principal Process Integration Engineer Higashihiroshima, 34, JP 17 Mac 2019
Japan Technology Center (JTC) Principal Process Integration Engineer Higashihiroshima, 34, JP 17 Mac 2019
Campus_Design Verification Engineer-DRAM R&D in Kanagawa, Japan Hashimoto, 14, JP 17 Mac 2019
ENGINEER PACKAGING INTEGRATION
ENGINEER PACKAGING INTEGRATION Taichung City, TXG, TW 16 Mac 2019
Taichung City, TXG, TW 16 Mac 2019
R&D Group - Patterning Solutions Technologist Boise, ID, US 16 Mac 2019
3D XPoint Principal YE Engineer-Lehi Tech Center Lehi, UT, US 16 Mac 2019
APD Singapore PCVD Process and Equipment Development Sr Engineer Singapore, 02, SG 16 Mac 2019
IT Systems Administrator
IT Systems Administrator Manassas, VA, US 16 Mac 2019
Manassas, VA, US 16 Mac 2019
STC NAND Senior Integrated Fail Mode Analysis Engineer SINGAPORE, 03, SG 16 Mac 2019
IT Network Engineer
IT Network Engineer Hyderabad, AP, IN 16 Mac 2019
Hyderabad, AP, IN 16 Mac 2019
Environmental Engineer
Environmental Engineer Boise, ID, US 16 Mac 2019
Boise, ID, US 16 Mac 2019
Technician- APTD CHARACTERIZATION 1
Technician- APTD CHARACTERIZATION 1 Taichung City, TXG, TW 16 Mac 2019
Taichung City, TXG, TW 16 Mac 2019