Pekerjaan Kejuruteraan

Sertai salah satu penyedia penyelesaian semikonduktor maju paling inovatif di dunia. Micron menggabungkan minda paling pintar dalam perniagaan dengan portfolio memori paling lebar di dunia, mencipta teknologi yang digunakan oleh jenama global peneraju untuk menjadikan pengkomputeran lebih pantas, perjalanan lebih selamat, penjagaan kesihatan lebih berkesan dan banyak lagi.

Oleh kerana Micron berusaha mengembangkan kepimpinan teknologinya melalui produk semikonduktor paling inovatif yang ada, jurutera kami akan memimpin usaha ini. Bersama dengan cabaran, pasukan kami berhadapan dengan setiap pengecilan proses dan peningkatan ketumpatan teknologi semasa kami, melahirkan peluang memori yang banyak bagi menguji batasan keupayaan jurutera kami.

Jika anda inginkan kerjaya yang menawarkan kepuasan peribadi, komuniti global dan peluang untuk kenaikan pangkat, pertimbangkan menyertai pasukan Kejuruteraan Micron.

 
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Set semula
Senior DRAM Design Engineer
Senior DRAM Design Engineer Boise, ID, US 25 November 2019
Boise, ID, US 25 November 2019
R&D Advanced Modeling Engineer (Post-Doctoral)
R&D Advanced Modeling Engineer (Post-Doctoral) Boise, ID, US 22 November 2019
Boise, ID, US 22 November 2019
Intern - Device Analytics
Intern - Device Analytics Boise, ID, US 22 November 2019
Boise, ID, US 22 November 2019
Intern - Software Engineer
Intern - Software Engineer Boise, ID, US 22 November 2019
Boise, ID, US 22 November 2019
Intern - Thin Film Process Development
Intern - Thin Film Process Development Boise, ID, US 05 Disember 2019
Boise, ID, US 05 Disember 2019
Intern- Global Quality
Intern- Global Quality Boise, ID, US 05 Disember 2019
Boise, ID, US 05 Disember 2019
Systems Quality Assurance - SSD Engineer
Systems Quality Assurance - SSD Engineer Boise, ID, US 11 Disember 2019
Boise, ID, US 11 Disember 2019
Product Engineer (3DXP)
Product Engineer (3DXP) Boise, ID, US 11 Disember 2019
Boise, ID, US 11 Disember 2019
Design for Test Engineer
Design for Test Engineer Boise, ID, US 10 Disember 2019
Boise, ID, US 10 Disember 2019
PRINCIPAL ENGINEER - DEG PRODUCT ENGINEER
PRINCIPAL ENGINEER - DEG PRODUCT ENGINEER Boise, ID, US 06 Disember 2019
Boise, ID, US 06 Disember 2019
PRODUCT ENGINEER HBM (High Bandwidth Memory) - DEG Boise, ID, US 06 Disember 2019
Systems Design Electrical Technician
Systems Design Electrical Technician Boise, ID, US 06 Disember 2019
Boise, ID, US 06 Disember 2019
3DXP Quality and Reliability Engineer
3DXP Quality and Reliability Engineer Boise, ID, US 06 Disember 2019
Boise, ID, US 06 Disember 2019
Intern-Emerging Memory Quality Engineer
Intern-Emerging Memory Quality Engineer Boise, ID, US 06 Disember 2019
Boise, ID, US 06 Disember 2019
Safety Engineer
Safety Engineer Boise, ID, US 04 Disember 2019
Boise, ID, US 04 Disember 2019
Intern-DEM Product Engineer
Intern-DEM Product Engineer Boise, ID, US 03 Disember 2019
Boise, ID, US 03 Disember 2019
Business Intelligence Analyst
Business Intelligence Analyst Boise, ID, US 30 November 2019
Boise, ID, US 30 November 2019
SSD Systems Architect/Technologist
SSD Systems Architect/Technologist Boise, ID, US 28 November 2019
Boise, ID, US 28 November 2019
Intern - CMOS Engineer
Intern - CMOS Engineer Boise, ID, US 29 November 2019
Boise, ID, US 29 November 2019
Product Engineer - Emerging Memory
Product Engineer - Emerging Memory Boise, ID, US 22 November 2019
Boise, ID, US 22 November 2019
NAND Product Development Engineer
NAND Product Development Engineer Boise, ID, US 27 November 2019
Boise, ID, US 27 November 2019
Thin Films Equipment Engineer
Thin Films Equipment Engineer Boise, ID, US 18 November 2019
Boise, ID, US 18 November 2019
Intern - SIG Embedded Software
Intern - SIG Embedded Software Boise, ID, US 18 November 2019
Boise, ID, US 18 November 2019
DEG PE Process - 180S Product Lead
DEG PE Process - 180S Product Lead Boise, ID, US 12 Disember 2019
Boise, ID, US 12 Disember 2019
Intern - NAND Memory Cell (Spring 2020)
Intern - NAND Memory Cell (Spring 2020) Boise, ID, US 11 Disember 2019
Boise, ID, US 11 Disember 2019