Pekerjaan Kejuruteraan

Sertai salah satu penyedia penyelesaian semikonduktor maju paling inovatif di dunia. Micron menggabungkan minda paling pintar dalam perniagaan dengan portfolio memori paling lebar di dunia, mencipta teknologi yang digunakan oleh jenama global peneraju untuk menjadikan pengkomputeran lebih pantas, perjalanan lebih selamat, penjagaan kesihatan lebih berkesan dan banyak lagi.

Oleh kerana Micron berusaha mengembangkan kepimpinan teknologinya melalui produk semikonduktor paling inovatif yang ada, jurutera kami akan memimpin usaha ini. Bersama dengan cabaran, pasukan kami berhadapan dengan setiap pengecilan proses dan peningkatan ketumpatan teknologi semasa kami, melahirkan peluang memori yang banyak bagi menguji batasan keupayaan jurutera kami.

Jika anda inginkan kerjaya yang menawarkan kepuasan peribadi, komuniti global dan peluang untuk kenaikan pangkat, pertimbangkan menyertai pasukan Kejuruteraan Micron.

 
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Principal STA Engineer
Principal STA Engineer Hyderabad, AP, IN 26 Disember 2019
Hyderabad, AP, IN 26 Disember 2019
Senior Engineer, Power Integrity
Senior Engineer, Power Integrity Hyderabad, AP, IN 26 Disember 2019
Hyderabad, AP, IN 26 Disember 2019
Fab10 Process Control System Engineer
Fab10 Process Control System Engineer Singapore, 03, SG 25 Disember 2019
Singapore, 03, SG 25 Disember 2019
Managed NAND Product Validation Engineer
Managed NAND Product Validation Engineer shanghai, 31, CN 25 Disember 2019
shanghai, 31, CN 25 Disember 2019
Senior/Principal New Package Developing Engineer- ADVANCED PACKAGE DEVELOPMENT Taichung, TXG, TW 25 Disember 2019
Pre-Stacking Engineer- ADVANCED PACKAGE DEVELOPMENT
Pre-Stacking Engineer- ADVANCED PACKAGE DEVELOPMENT Taichung, TXG, TW 25 Disember 2019
Taichung, TXG, TW 25 Disember 2019
Senior/Principal Stacking Engineer- ADVANCED PACKAGE DEVELOPMENT Taichung, TXG, TW 25 Disember 2019
【臺中市后里區】ATE PHOTO MANAGER / 先進技術轉移處 微影製程課經理 Taichung, TXG, TW 25 Disember 2019
NAND Design Engineer
NAND Design Engineer Boise, ID, US 25 Disember 2019
Boise, ID, US 25 Disember 2019
ATE PHOTO Engineer
ATE PHOTO Engineer Taichung city, TXG, TW 25 Disember 2019
Taichung city, TXG, TW 25 Disember 2019
Advanced Packaging Integration Manager
Advanced Packaging Integration Manager Taichung City, TXG, TW 25 Disember 2019
Taichung City, TXG, TW 25 Disember 2019
Intern - Signal Processing (PhD)
Intern - Signal Processing (PhD) San Jose, CA, US 25 Disember 2019
San Jose, CA, US 25 Disember 2019
Sr/NAND Product Engineer - PE Reliability
Sr/NAND Product Engineer - PE Reliability SINGAPORE, 01, SG 25 Disember 2019
SINGAPORE, 01, SG 25 Disember 2019
PRINCIPAL ENGINEER, NON-VOLATILE PRODUCT ENGINEERING
PRINCIPAL ENGINEER, NON-VOLATILE PRODUCT ENGINEERING Singapore, 03, SG 25 Disember 2019
Singapore, 03, SG 25 Disember 2019
DRAM Product Engineer
DRAM Product Engineer Taichung, TXG, TW 25 Disember 2019
Taichung, TXG, TW 25 Disember 2019
Senior DRAM Design Engineer
Senior DRAM Design Engineer Boise, ID, US 25 Disember 2019
Boise, ID, US 25 Disember 2019
ENGINEERING TOOL INSTALL ENGINEER
ENGINEERING TOOL INSTALL ENGINEER Singapore, 03, SG 25 Disember 2019
Singapore, 03, SG 25 Disember 2019
Firmware Test Automation Engineer
Firmware Test Automation Engineer Longmont, CO, US 25 Disember 2019
Longmont, CO, US 25 Disember 2019
Firmware Test Automation Engineer
Firmware Test Automation Engineer Boise, ID, US 25 Disember 2019
Boise, ID, US 25 Disember 2019
AMS Verification Engineer(Senior)
AMS Verification Engineer(Senior) hyderabad, AP, IN 25 Disember 2019
hyderabad, AP, IN 25 Disember 2019
Data Scientist - Technology Development
Data Scientist - Technology Development Hyderabad, AP, IN 25 Disember 2019
Hyderabad, AP, IN 25 Disember 2019
Advanced Materials Modeling & Process Analytics Engineer Boise, ID, US 25 Disember 2019
SR/PRINCIPLE ENGINEER - NAND PE RELIABILITY
SR/PRINCIPLE ENGINEER - NAND PE RELIABILITY SINGAPORE, 01, SG 25 Disember 2019
SINGAPORE, 01, SG 25 Disember 2019
VP, MTB
VP, MTB Taichung, TXG, TW 25 Disember 2019
Taichung, TXG, TW 25 Disember 2019
ENGINEER, PACKAGE CHARACTERIZATION
ENGINEER, PACKAGE CHARACTERIZATION Taichung, TXG, TW 25 Disember 2019
Taichung, TXG, TW 25 Disember 2019