Pekerjaan Kejuruteraan

Sertai salah satu penyedia penyelesaian semikonduktor maju paling inovatif di dunia. Micron menggabungkan minda paling pintar dalam perniagaan dengan portfolio memori paling lebar di dunia, mencipta teknologi yang digunakan oleh jenama global peneraju untuk menjadikan pengkomputeran lebih pantas, perjalanan lebih selamat, penjagaan kesihatan lebih berkesan dan banyak lagi.

Oleh kerana Micron berusaha mengembangkan kepimpinan teknologinya melalui produk semikonduktor paling inovatif yang ada, jurutera kami akan memimpin usaha ini. Bersama dengan cabaran, pasukan kami berhadapan dengan setiap pengecilan proses dan peningkatan ketumpatan teknologi semasa kami, melahirkan peluang memori yang banyak bagi menguji batasan keupayaan jurutera kami.

Jika anda inginkan kerjaya yang menawarkan kepuasan peribadi, komuniti global dan peluang untuk kenaikan pangkat, pertimbangkan menyertai pasukan Kejuruteraan Micron.

 
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2020 Intern - Smart Manufacturing & AI Data Science
2020 Intern - Smart Manufacturing & AI Data Science Singapore, 03, SG 13 November 2019
Singapore, 03, SG 13 November 2019
2020 Intern - F10 MFG 2
2020 Intern - F10 MFG 2 Singapore, 01, SG 13 November 2019
Singapore, 01, SG 13 November 2019
Fab10N PEE CVD INTN - 3D NAND Film Deposition Process Control Optimisation Singapore, 03, SG 13 November 2019
2020 Intern - MSB Test
2020 Intern - MSB Test Singapore, 01, SG 13 November 2019
Singapore, 01, SG 13 November 2019
Intern - Analytics/Modelling Engineer
Intern - Analytics/Modelling Engineer Singapore, 03, SG 13 November 2019
Singapore, 03, SG 13 November 2019
2020 Intern - F10 PEE Photo
2020 Intern - F10 PEE Photo Singapore, 01, SG 13 November 2019
Singapore, 01, SG 13 November 2019
Intern - Smart Manufacturing & AI Data Science Engineer
Intern - Smart Manufacturing & AI Data Science Engineer Singapore, 03, SG 13 November 2019
Singapore, 03, SG 13 November 2019
R&D Dry Etch Process Development Engineer
R&D Dry Etch Process Development Engineer Boise, ID, US 13 November 2019
Boise, ID, US 13 November 2019
Senior Manager, Metrology-NVM
Senior Manager, Metrology-NVM Boise, ID, US 13 November 2019
Boise, ID, US 13 November 2019
New College Grad: Non-Volatile Memory Engineering
New College Grad: Non-Volatile Memory Engineering Boise, ID, US 13 November 2019
Boise, ID, US 13 November 2019
EMI Characterization Engineer
EMI Characterization Engineer Boise, ID, US 13 November 2019
Boise, ID, US 13 November 2019
MSB Site Quality Product Quality Assurance (PQA) Engineer 1 Singapore, 01, SG 13 November 2019
SSD FIRMWARE ENGINEER
SSD FIRMWARE ENGINEER Singapore, 01, SG 13 November 2019
Singapore, 01, SG 13 November 2019
Senior CAD Engineer - Technology Development
Senior CAD Engineer - Technology Development Hyderabad, AP, IN 13 November 2019
Hyderabad, AP, IN 13 November 2019
Intern - NAND Memory Cell (Spring 2020)
Intern - NAND Memory Cell (Spring 2020) Boise, ID, US 13 November 2019
Boise, ID, US 13 November 2019
DESIGN RULE Engineer
DESIGN RULE Engineer Boise, ID, US 13 November 2019
Boise, ID, US 13 November 2019
Managed NAND Firmware Engineer
Managed NAND Firmware Engineer shanghai, 31, CN 13 November 2019
shanghai, 31, CN 13 November 2019
Equipment Technician
Equipment Technician Manassas, VA, US 13 November 2019
Manassas, VA, US 13 November 2019
MSB Post Electrical Equipment Engineer
MSB Post Electrical Equipment Engineer Singapore, 01, SG 13 November 2019
Singapore, 01, SG 13 November 2019
Operations Improvement Engineer
Operations Improvement Engineer Singapore, 01, SG 13 November 2019
Singapore, 01, SG 13 November 2019
Semiconductor Process Safety Engineer
Semiconductor Process Safety Engineer Manassas, VA, US 13 November 2019
Manassas, VA, US 13 November 2019
Senior Module Test Process Engineer
Senior Module Test Process Engineer Batu Kawan, 07, MY 13 November 2019
Batu Kawan, 07, MY 13 November 2019
NVM SSD QRA Intern
NVM SSD QRA Intern Bengaluru, KA, IN 13 November 2019
Bengaluru, KA, IN 13 November 2019
2020 Intern - F10 PEE ADTS Photolithography 2
2020 Intern - F10 PEE ADTS Photolithography 2 Singapore, 02, SG 13 November 2019
Singapore, 02, SG 13 November 2019
Product Engineer (3DXP)
Product Engineer (3DXP) Boise, ID, US 13 November 2019
Boise, ID, US 13 November 2019