Engineering Jobs

Join one of the world's most innovative providers of advanced semiconductor solutions. Micron combines the brightest minds in the business with the world’s broadest memory portfolio, creating technology that leading global brands use to make computing faster, travel safer, healthcare more effective, and much more.

As Micron looks to grow its technology leadership with the most innovative semiconductor products available, our engineers will lead the charge. Along with the challenges our teams face with every process shrink and density increase of our current technologies, emerging memory opportunities abound to test the very limits of our engineers’ abilities.

If you want a career that offers personal satisfaction, global communities, and the opportunity for advancement, consider joining Micron’s Engineering team.

 

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フォトリソグラフィプロセスエンジニア 1 1 1 Higashihiroshima, 34, JP Jan 2, 2019
データサイエンティスト(Data Scientist)
データサイエンティスト(Data Scientist) Higashihiroshima, 34, JP Jan 11, 2019
Higashihiroshima, 34, JP Jan 11, 2019
YE TEM/EQ Engineer
YE TEM/EQ Engineer Taichung, TXG, TW Jan 16, 2019
Taichung, TXG, TW Jan 16, 2019
YE Lab Technician
YE Lab Technician Taichung, TXQ, TW Jan 16, 2019
Taichung, TXQ, TW Jan 16, 2019
YE Failure Analysis Engineer 1
YE Failure Analysis Engineer 1 Taichung, TXQ, TW Jan 5, 2019
Taichung, TXQ, TW Jan 5, 2019
YE Engineer
YE Engineer Taichung, TXQ, TW Jan 12, 2019
Taichung, TXQ, TW Jan 12, 2019
Wire Bond Development Engineer
Wire Bond Development Engineer Muar, 01, MY Jan 20, 2019
Muar, 01, MY Jan 20, 2019
Wet Process Shift Equipment Technician
Wet Process Shift Equipment Technician Boise, ID, US Jan 12, 2019
Boise, ID, US Jan 12, 2019
Wet Process Engineer
Wet Process Engineer Manassas, VA, US Jan 4, 2019
Manassas, VA, US Jan 4, 2019
Wet Process Development Engineer
Wet Process Development Engineer Boise, ID, US Jan 11, 2019
Boise, ID, US Jan 11, 2019
WET process and equipment engineer
WET process and equipment engineer Higashihiroshima-shi, 34, JP Dec 26, 2018
Higashihiroshima-shi, 34, JP Dec 26, 2018
Wafer Test Program Developer
Wafer Test Program Developer Taichung, TXQ, TW Jan 15, 2019
Taichung, TXQ, TW Jan 15, 2019
Wafer bond Equipment Engineer
Wafer bond Equipment Engineer TAICHUNG, TXG, TW Jan 15, 2019
TAICHUNG, TXG, TW Jan 15, 2019
Validation Program Engineer
Validation Program Engineer Longmont, CO, US Jan 2, 2019
Longmont, CO, US Jan 2, 2019
Validation Engineer 2
Validation Engineer 2 Arzano, NA, IT Jan 17, 2019
Arzano, NA, IT Jan 17, 2019
Validation Architect
Validation Architect shanghai, 31, CN Jan 13, 2019
shanghai, 31, CN Jan 13, 2019
TPCE Test Equipment Engineer
TPCE Test Equipment Engineer Taichung, TXG, TW Jan 9, 2019
Taichung, TXG, TW Jan 9, 2019
TPCE Test Engineering Manager
TPCE Test Engineering Manager Singapore, 01, SG Jan 9, 2019
Singapore, 01, SG Jan 9, 2019
TPCE Test Engineer
TPCE Test Engineer Boise, ID, US Jan 18, 2019
Boise, ID, US Jan 18, 2019
TPCE SSD Test Engineer
TPCE SSD Test Engineer Singapore, 01, SG Jan 5, 2019
Singapore, 01, SG Jan 5, 2019
TPCE SSD Test Engineer
TPCE SSD Test Engineer Penang, 07, MY Jan 14, 2019
Penang, 07, MY Jan 14, 2019
TPCE Post-E Equipment Engineer
TPCE Post-E Equipment Engineer 台中, TXG, TW Jan 10, 2019
台中, TXG, TW Jan 10, 2019
TPCE MOD/SSD Equipment Engineer
TPCE MOD/SSD Equipment Engineer Singapore, 01, SG Jan 10, 2019
Singapore, 01, SG Jan 10, 2019
TPCE Applications Software Engineer
TPCE Applications Software Engineer Taichung, TXG, TW Jan 16, 2019
Taichung, TXG, TW Jan 16, 2019
Tokyo-3D NAND RG-Senior Director, Device Engineering Kamata, 13, JP Jan 17, 2019