技術開發工作

加入全球最具創新能力及先進半導體解決方案之一的領導廠商。Micron 將最有智慧的人才與全球最廣泛的記憶體產品系列做完美組合,打造領先技術,提供全球各大領先品牌使用,讓計算更快、旅行更加安全、醫療保健更高效率等等。

Your innovation. Our Memory.

在美光推進其技術領導地位的過程中,技術研發團隊扮演了開疆闢土的先鋒。技術研發團隊要面對的工作挑戰可說是瞬息萬變,因為工程師們需持續超越看似不可能的任務,將最創新的半導體產品推出問世。也許從僅僅一個在計算紙、甚至是餐廳紙巾上的隨手描畫開始,這些信手拈來的靈感將由草圖轉變為專利、原型,甚至於是能撼動整個產業的新技術。

如果您想擁有個人滿意的職涯、全球化視野及提升個人能力的機會,歡迎您加入 Micron技術開發團隊。

 
將分類儲存為 RSS 摘要
搜尋結果: "". 第 1/5 頁,第 1 筆至第 25 筆結果
標題 地點 日期 Sort descending
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Scribe Layout & Design Engineer
Scribe Layout & Design Engineer Hyderabad, AP, IN 2020/8/4
Hyderabad, AP, IN 2020/8/4
R&D Wet Process Development Engineer
R&D Wet Process Development Engineer Boise, ID, US 2020/8/3
Boise, ID, US 2020/8/3
NTI PCVD Equipment Development Sr Engineer
NTI PCVD Equipment Development Sr Engineer Singapore, 03, SG 2020/8/3
Singapore, 03, SG 2020/8/3
Module Development Lab Engineer
Module Development Lab Engineer Boise, ID, US 2020/8/3
Boise, ID, US 2020/8/3
Senior Engineer, NAND Design Rule
Senior Engineer, NAND Design Rule Boise, ID, US 2020/8/3
Boise, ID, US 2020/8/3
Mask Equipment Support Engineer
Mask Equipment Support Engineer Boise, ID, US 2020/8/2
Boise, ID, US 2020/8/2
Senior Strategy Director - NAND System
Senior Strategy Director - NAND System San Jose, CA, US 2020/8/2
San Jose, CA, US 2020/8/2
Micron-R&D Reliability Device Engineer/Manager
Micron-R&D Reliability Device Engineer/Manager Higashi Hiroshima, 34, JP 2020/7/31
Higashi Hiroshima, 34, JP 2020/7/31
Information Administrator
Information Administrator Hyderabad, TG, IN 2020/7/31
Hyderabad, TG, IN 2020/7/31
Security Engineer
Security Engineer Hyderabad, TG, IN 2020/7/31
Hyderabad, TG, IN 2020/7/31
INTERN_Advanced NAND Team Engineer
INTERN_Advanced NAND Team Engineer Vimercate, MB, IT 2020/7/31
Vimercate, MB, IT 2020/7/31
R&D Senior Reliability Manager/Engineer
R&D Senior Reliability Manager/Engineer Higashi Hiroshima, 34, JP 2020/7/31
Higashi Hiroshima, 34, JP 2020/7/31
HVAC/R- Ops
HVAC/R- Ops Boise, ID, US 2020/7/31
Boise, ID, US 2020/7/31
New Technology Equipment Developing Engineer
New Technology Equipment Developing Engineer Taichung, TXG, TW 2020/7/31
Taichung, TXG, TW 2020/7/31
TECHNICIAN-PHOTO DUV OPERATIONS
TECHNICIAN-PHOTO DUV OPERATIONS Boise, ID, US 2020/7/31
Boise, ID, US 2020/7/31
R&D Dry Etch Process Development Engineer Boise, ID, US 2020/7/31
ENGINEER-EM DESIGN
ENGINEER-EM DESIGN Folsom, CA, US 2020/7/30
Folsom, CA, US 2020/7/30
Senior CAD Engineer, ASIC
Senior CAD Engineer, ASIC San Jose, CA, US 2020/7/29
San Jose, CA, US 2020/7/29
ADVANCED PACKAGE DEVELOPMENT ENGINEER
ADVANCED PACKAGE DEVELOPMENT ENGINEER Taichung, TXG, TW 2020/7/29
Taichung, TXG, TW 2020/7/29
TECHNICIAN-DRY ETCH OPERATIONS 1
TECHNICIAN-DRY ETCH OPERATIONS 1 Boise, ID, US 2020/7/29
Boise, ID, US 2020/7/29
Sr CMP Process Development Engineer
Sr CMP Process Development Engineer Boise, ID, US 2020/7/29
Boise, ID, US 2020/7/29
Director of CAD Engineering
Director of CAD Engineering San Jose, CA, US 2020/7/29
San Jose, CA, US 2020/7/29
The Advanced Packaging Metro RDA - Data Engineer Taichung, TXG, TW 2020/7/28
Thin Films - Process Development Engineer Boise, ID, US 2020/7/28
SENIOR ENGINEER, NAND PROCESS INTEGRATION
SENIOR ENGINEER, NAND PROCESS INTEGRATION Singapore, 03, SG 2020/7/28
Singapore, 03, SG 2020/7/28