技術開發工作

加入全球最具創新能力及先進半導體解決方案之一的領導廠商。Micron 將最有智慧的人才與全球最廣泛的記憶體產品系列做完美組合,打造領先技術,提供全球各大領先品牌使用,讓計算更快、旅行更加安全、醫療保健更高效率等等。

Your innovation. Our Memory.

在美光推進其技術領導地位的過程中,技術研發團隊扮演了開疆闢土的先鋒。技術研發團隊要面對的工作挑戰可說是瞬息萬變,因為工程師們需持續超越看似不可能的任務,將最創新的半導體產品推出問世。也許從僅僅一個在計算紙、甚至是餐廳紙巾上的隨手描畫開始,這些信手拈來的靈感將由草圖轉變為專利、原型,甚至於是能撼動整個產業的新技術。

如果您想擁有個人滿意的職涯、全球化視野及提升個人能力的機會,歡迎您加入 Micron技術開發團隊。

 
將分類儲存為 RSS 摘要
搜尋結果: "". 第 1/4 頁,第 1 筆至第 25 筆結果
標題 地點 日期 Sort ascending
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ENGINEER, PROCESS INTEGRATION
ENGINEER, PROCESS INTEGRATION Taichung, TXG, TW 2020/4/28
Taichung, TXG, TW 2020/4/28
Array Characterization Engineer - Emerging Memory Cell Development Boise, ID, US 2020/4/29
Line Operations Engineer
Line Operations Engineer Boise, ID, US 2020/4/29
Boise, ID, US 2020/4/29
Shift Fab Support Equipment Technician
Shift Fab Support Equipment Technician Boise, ID, US 2020/4/29
Boise, ID, US 2020/4/29
Package Simulation Engineer
Package Simulation Engineer Boise, ID, US 2020/4/29
Boise, ID, US 2020/4/29
Hardware Architect
Hardware Architect Seattle, WA, US 2020/4/30
Seattle, WA, US 2020/4/30
Director - Technical Leadership Program
Director - Technical Leadership Program Boise, ID, US 2020/4/30
Boise, ID, US 2020/4/30
Advanced Multiscale Process Modeling Engineer
Advanced Multiscale Process Modeling Engineer Hyderabad, AP, IN 2020/4/30
Hyderabad, AP, IN 2020/4/30
R&D DRY ETCH PROCESS DEVELOPMENT ENGINEER Boise, ID, US 2020/5/1
Emerging Memory Process Integration Engineer 1 Boise, ID, US 2020/5/1
Principal Development Engineer
Principal Development Engineer Boise, ID, US 2020/5/1
Boise, ID, US 2020/5/1
New Technology Introduction Intern - NAND Device Singapore, 03, SG 2020/5/1
Senior Device Integration Engineer
Senior Device Integration Engineer Boise, ID, US 2020/5/1
Boise, ID, US 2020/5/1
Contamination Control Engineer
Contamination Control Engineer Boise, ID, US 2020/5/1
Boise, ID, US 2020/5/1
Atomic Layer Etch (ALE) Process Technologist Boise, ID, US 2020/5/2
Process Control Systems Lead/Manager
Process Control Systems Lead/Manager Boise, ID, US 2020/5/2
Boise, ID, US 2020/5/2
FEM Simulation and Data Modeling Engineer - Advanced Packaging Technology Development Boise, ID, US 2020/5/2
Principal - Thin Films Process Development Engineer 1 Boise, ID, US 2020/5/2
TECHNICIAN-DRY ETCH OPERATIONS 1
TECHNICIAN-DRY ETCH OPERATIONS 1 Boise, ID, US 2020/5/3
Boise, ID, US 2020/5/3
Engineer, CMP-DRAM/EM
Engineer, CMP-DRAM/EM Boise, ID, US 2020/5/4
Boise, ID, US 2020/5/4
Thin Films Process Development Engineer Boise, ID, US 2020/5/4
HVAC/R- Ops 1
HVAC/R- Ops 1 Boise, ID, US 2020/5/6
Boise, ID, US 2020/5/6
Principal\SR Thin Films Engineer
Principal\SR Thin Films Engineer Boise, ID, US 2020/5/6
Boise, ID, US 2020/5/6
Senior Strategy Director - NAND System
Senior Strategy Director - NAND System San Jose, CA, US 2020/5/7
San Jose, CA, US 2020/5/7
Strategy Director - DRAM Design
Strategy Director - DRAM Design San Jose, CA, US 2020/5/7
San Jose, CA, US 2020/5/7