技術開發工作

加入全球最具創新能力及先進半導體解決方案之一的領導廠商。Micron 將最有智慧的人才與全球最廣泛的記憶體產品系列做完美組合,打造領先技術,提供全球各大領先品牌使用,讓計算更快、旅行更加安全、醫療保健更高效率等等。

Your innovation. Our Memory.

在美光推進其技術領導地位的過程中,技術研發團隊扮演了開疆闢土的先鋒。技術研發團隊要面對的工作挑戰可說是瞬息萬變,因為工程師們需持續超越看似不可能的任務,將最創新的半導體產品推出問世。也許從僅僅一個在計算紙、甚至是餐廳紙巾上的隨手描畫開始,這些信手拈來的靈感將由草圖轉變為專利、原型,甚至於是能撼動整個產業的新技術。

如果您想擁有個人滿意的職涯、全球化視野及提升個人能力的機會,歡迎您加入 Micron技術開發團隊。

將分類儲存為 RSS 摘要
搜尋結果: "". 第 1/6 頁,第 1 筆至第 25 筆結果
標題 地點 日期 Sort descending
重設
PIR Shift Process Engineer (PERM)
PIR Shift Process Engineer (PERM) Manassas, VA, US 2019/3/21
Manassas, VA, US 2019/3/21
Data Engineer (PERM)
Data Engineer (PERM) Manassas, VA, US 2019/3/21
Manassas, VA, US 2019/3/21
Front End Software Support Engineer (PERM)
Front End Software Support Engineer (PERM) Manassas, VA, US 2019/3/21
Manassas, VA, US 2019/3/21
CVD Process Engineer (PERM)
CVD Process Engineer (PERM) Manassas, VA, US 2019/3/21
Manassas, VA, US 2019/3/21
Oracle Database Administrator (PERM)
Oracle Database Administrator (PERM) Manassas, VA, US 2019/3/21
Manassas, VA, US 2019/3/21
IT Disaster Recovery Analyst
IT Disaster Recovery Analyst Hyderabad, AP, IN 2019/3/21
Hyderabad, AP, IN 2019/3/21
IT Risk Analyst
IT Risk Analyst Hyderabad, AP, IN 2019/3/21
Hyderabad, AP, IN 2019/3/21
MN Design Engineer
MN Design Engineer Arzano, 72, IT 2019/3/21
Arzano, 72, IT 2019/3/21
APTD Program Manager
APTD Program Manager Taichung, TXG, TW 2019/3/21
Taichung, TXG, TW 2019/3/21
Manufacturing Operations Improvement Engineer (PERM) Manassas, VA, US 2019/3/21
Photolithography Process Development Engineer R&D Boise, ID, US 2019/3/21
NAND Process Integration Engineer
NAND Process Integration Engineer Boise, ID, US 2019/3/21
Boise, ID, US 2019/3/21
SR. ENGINEER, PFA
SR. ENGINEER, PFA Taichung City, TXG, TW 2019/3/20
Taichung City, TXG, TW 2019/3/20
SR ENGINEER, 3DIC PACKAGE RELIABILITY
SR ENGINEER, 3DIC PACKAGE RELIABILITY Taichung City, TXG, TW 2019/3/20
Taichung City, TXG, TW 2019/3/20
ENGINEER, PACKAGE EFA
ENGINEER, PACKAGE EFA Taichung City, TXG, TW 2019/3/20
Taichung City, TXG, TW 2019/3/20
Sr. ENGINEER, CMP
Sr. ENGINEER, CMP Taichung, TXG, TW 2019/3/19
Taichung, TXG, TW 2019/3/19
Package Integration Engineer - Technology Development Taichung City, TXG, TW 2019/3/19
Senior Integration Modeling and Analytics Engineer Boise, ID, US 2019/3/19
Package Development Manager - NPI
Package Development Manager - NPI Taichung City, TXG, TW 2019/3/18
Taichung City, TXG, TW 2019/3/18
ENGINEER-PACKAGE LAYOUT DESIGN
ENGINEER-PACKAGE LAYOUT DESIGN Taichung City, TXG, TW 2019/3/18
Taichung City, TXG, TW 2019/3/18
IT LEAD, SOFTWARE SERVICES
IT LEAD, SOFTWARE SERVICES Taichung, TXG, TW 2019/3/18
Taichung, TXG, TW 2019/3/18
Intern - Process Integration Engineering Boise, ID, US 2019/3/18
Package Design Engineer
Package Design Engineer Boise, ID, US 2019/3/18
Boise, ID, US 2019/3/18
Data Engineer - Technology Development
Data Engineer - Technology Development Boise, ID, US 2019/3/18
Boise, ID, US 2019/3/18
Campus_R&D Process Development Engineer
Campus_R&D Process Development Engineer Hiroshima, 34, JP 2019/3/17
Hiroshima, 34, JP 2019/3/17