工程師相關工作

加入全球最具創新能力及先進半導體解決方案之一的領導廠商。Micron 將最有智慧的人才與全球最廣泛的記憶體產品系列做完美組合,打造領先技術,提供全球各大領先品牌使用,讓計算更快、旅行更加安全、醫療保健更高效率等等。

Your innovation. Our Memory.

在 Micron 著眼於利用最具創新能力的半導體產品及發展其技術領導地位的同時,我們的工程師將率先做出表率。隨著每一次技術演進以及技術層次的提升,我們的團隊面臨著許多的挑戰,新興的記憶體機會將考驗著我們工程師的能力。

如果您想擁有個人滿意的職涯、全球化視野及提升個人能力的機會,歡迎您加入 Micron工程師團隊。

 
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搜尋結果: "". 第 3/21 頁,第 51 筆至第 75 筆結果
標題 地點 日期 Sort descending
重設
Manager, SIG Quality
Manager, SIG Quality Penang, 07, MY 2020/8/6
Penang, 07, MY 2020/8/6
Principal Engineer, 3DXP Firmware Development Bengaluru, KA, IN 2020/8/6
PI ENGINEER
PI ENGINEER Taichung, TXQ, TW 2020/8/6
Taichung, TXQ, TW 2020/8/6
Assembly Process Engineer - Post Encap (MVCW) Penang, 07, MY 2020/8/6
Senior Engineer, SSD Firmware Validation
Senior Engineer, SSD Firmware Validation Hyderabad, AP, IN 2020/8/6
Hyderabad, AP, IN 2020/8/6
Senior DRAM Product Engineer
Senior DRAM Product Engineer Boise, ID, US 2020/8/6
Boise, ID, US 2020/8/6
NVE MNAND Senior Product Engineer 1
NVE MNAND Senior Product Engineer 1 Singapore, 01, SG 2020/8/6
Singapore, 01, SG 2020/8/6
TSE Probe Test Development Engineer
TSE Probe Test Development Engineer Singapore, 03, SG 2020/8/6
Singapore, 03, SG 2020/8/6
TSE KEG Equipment Engineer
TSE KEG Equipment Engineer BOISE, ID, US 2020/8/6
BOISE, ID, US 2020/8/6
ATE DIFF Engineer
ATE DIFF Engineer Taichung, TXG, TW 2020/8/6
Taichung, TXG, TW 2020/8/6
Principal\SR Thin Films Engineer
Principal\SR Thin Films Engineer Boise, ID, US 2020/8/6
Boise, ID, US 2020/8/6
DRAM Product Engineer - High Speed Test
DRAM Product Engineer - High Speed Test Munich, BY, DE 2020/8/6
Munich, BY, DE 2020/8/6
ENGINEER- QEM PQE Yield Engineering (EFA)
ENGINEER- QEM PQE Yield Engineering (EFA) Singapore, 03, SG 2020/8/6
Singapore, 03, SG 2020/8/6
QC ENGINEER
QC ENGINEER Taichung, TXG, TW 2020/8/6
Taichung, TXG, TW 2020/8/6
PHOTO METRO ENGINEER
PHOTO METRO ENGINEER Higashi Hiroshima, 34, JP 2020/8/6
Higashi Hiroshima, 34, JP 2020/8/6
Join our ATE team in Taiwan Taichung
Join our ATE team in Taiwan Taichung Taichung, TXG, TW 2020/8/6
Taichung, TXG, TW 2020/8/6
Technician, MXA Module Test Eng (SLT Motherboard Maintenance) 3 Xi'an, 61, CN 2020/8/6
3DI / HBM Process Integration Engineer
3DI / HBM Process Integration Engineer Taichung, TXG, TW 2020/8/6
Taichung, TXG, TW 2020/8/6
LAB EQUIPMENT ENGINEER - PYE
LAB EQUIPMENT ENGINEER - PYE Taichung, TXG, TW 2020/8/6
Taichung, TXG, TW 2020/8/6
Global AMHS Engineer
Global AMHS Engineer Taichung, TXG, TW 2020/8/6
Taichung, TXG, TW 2020/8/6
Global AMHS Engineer
Global AMHS Engineer Higashi Hiroshima, 34, JP 2020/8/6
Higashi Hiroshima, 34, JP 2020/8/6
Technician, MXA Test Floor Eng. (Equipment Maintenance) Xi'an, 61, CN 2020/8/6
Sr. Technician, MXA Burn In Eng.(Engineering Data Technician Trainer) Xi'an, 61, CN 2020/8/6
Test Equipment Engineer
Test Equipment Engineer Penang, 07, MY 2020/8/6
Penang, 07, MY 2020/8/6
NSBE Conference - New Grad
NSBE Conference - New Grad Boise, ID, US 2020/8/6
Boise, ID, US 2020/8/6