工程師相關工作

加入全球最具創新能力及先進半導體解決方案之一的領導廠商。Micron 將最有智慧的人才與全球最廣泛的記憶體產品系列做完美組合,打造領先技術,提供全球各大領先品牌使用,讓計算更快、旅行更加安全、醫療保健更高效率等等。

Your innovation. Our Memory.

在 Micron 著眼於利用最具創新能力的半導體產品及發展其技術領導地位的同時,我們的工程師將率先做出表率。隨著每一次技術演進以及技術層次的提升,我們的團隊面臨著許多的挑戰,新興的記憶體機會將考驗著我們工程師的能力。

如果您想擁有個人滿意的職涯、全球化視野及提升個人能力的機會,歡迎您加入 Micron工程師團隊。

將分類儲存為 RSS 摘要
搜尋結果: "". 第 1/24 頁,第 1 筆至第 25 筆結果
標題 地點 日期 Sort descending
重設
Photo Process Engineer
Photo Process Engineer Taichung, TXQ, TW 2019/5/22
Taichung, TXQ, TW 2019/5/22
MCT Big Data Engineer
MCT Big Data Engineer Singapore, 03, SG 2019/5/22
Singapore, 03, SG 2019/5/22
Senior Assembly Process Engineer - Wire Bond
Senior Assembly Process Engineer - Wire Bond Batu Kawan, 07, MY 2019/5/22
Batu Kawan, 07, MY 2019/5/22
Non-Volatile Memory QRA Sr. Engineer (NVMQRA) Solid State Drive (SSD) Bengaluru, KA, IN 2019/5/22
Manager, ADT Process Integration
Manager, ADT Process Integration Muar, 01, MY 2019/5/22
Muar, 01, MY 2019/5/22
Manager, New Product Management 1
Manager, New Product Management 1 Muar, 01, MY 2019/5/22
Muar, 01, MY 2019/5/22
SSD Senior/Test Engineer
SSD Senior/Test Engineer Singapore, 01, SG 2019/5/22
Singapore, 01, SG 2019/5/22
2019 intern- Process Engineer
2019 intern- Process Engineer Taoyuan, TAO, TW 2019/5/22
Taoyuan, TAO, TW 2019/5/22
2019 intern- IE SIC Engineer
2019 intern- IE SIC Engineer Taoyuan, TAO, TW 2019/5/22
Taoyuan, TAO, TW 2019/5/22
2019 intern- IE EPM Engineer
2019 intern- IE EPM Engineer Taoyuan, TAO, TW 2019/5/22
Taoyuan, TAO, TW 2019/5/22
Senior/Test Engineer
Senior/Test Engineer Singapore, 01, SG 2019/5/22
Singapore, 01, SG 2019/5/22
Emerging Memory Array Characterization Engineer Boise, ID, US 2019/5/22
ENGINEER, PRODUCT ENGINEERING - AMBYX REL (Fresh Graduates are Welcome) Singapore, 01, SG 2019/5/22
Senior Assembly Equipment Engineer - Wire Bond
Senior Assembly Equipment Engineer - Wire Bond Batu Kawan, 07, MY 2019/5/22
Batu Kawan, 07, MY 2019/5/22
Senior Assembly Process Engineer - Die Attach
Senior Assembly Process Engineer - Die Attach Batu Kawan, 07, MY 2019/5/22
Batu Kawan, 07, MY 2019/5/22
Assembly Process Technician - Die Attach & Wire Bond Batu Kawan, 07, MY 2019/5/22
Senior Assembly Process Engineer - Wafer Thinning Batu Kawan, 07, MY 2019/5/22
Manager, Data Science
Manager, Data Science Boise, ID, US 2019/5/22
Boise, ID, US 2019/5/22
Fault Detection and Classification(FDC) IOT Engineer(FDC) Engineer Manassas, VA, US 2019/5/22
Site Automation Engineer
Site Automation Engineer Batu Kawan, 07, MY 2019/5/22
Batu Kawan, 07, MY 2019/5/22
Assembly Equipment Technician - Wafer Thinning and Dicing Batu Kawan, 07, MY 2019/5/22
Site Automation Manager
Site Automation Manager Batu Kawan, 07, MY 2019/5/22
Batu Kawan, 07, MY 2019/5/22
Assembly Process Technician - Wafer Thinning and Dicing Batu Kawan, 07, MY 2019/5/21
Assembly Equipment Technician - Die Attach & Wire Bond Batu Kawan, 07, MY 2019/5/21
Engineer- PAC Equipment
Engineer- PAC Equipment Boise, ID, US 2019/5/21
Boise, ID, US 2019/5/21