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在 Micron 著眼於利用最具創新能力的半導體產品及發展其技術領導地位的同時,我們的工程師將率先做出表率。隨著每一次技術演進以及技術層次的提升,我們的團隊面臨著許多的挑戰,新興的記憶體機會將考驗著我們工程師的能力。

如果您想擁有個人滿意的職涯、全球化視野及提升個人能力的機會,歡迎您加入 Micron工程師團隊。

 
將分類儲存為 RSS 摘要
搜尋結果: "". 第 1/19 頁,第 1 筆至第 25 筆結果
標題 地點 日期 Sort descending
重設
HBM/3DI Process Engineer
HBM/3DI Process Engineer Taichung, TXG, TW 2020/7/16
Taichung, TXG, TW 2020/7/16
Media Optimization Engineer
Media Optimization Engineer Folsom, CA, US 2020/7/16
Folsom, CA, US 2020/7/16
Module Development Lab Engineer
Module Development Lab Engineer Boise, ID, US 2020/7/16
Boise, ID, US 2020/7/16
SENIOR/ PRINCIPAL ENGINEER, CUSTOMER MAPPED QUALITY EXPERIENCE (CMQE) Singapore, 03, SG 2020/7/16
Quality and Reliability Technician (Open for fresh graduates) Penang, 07, MY 2020/7/16
Senior Engineer/Engineer, Control Engineering , Global Quality Assembly Test Quality Engineering Penang, 07, MY 2020/7/16
HBM/3DI Process Engineer
HBM/3DI Process Engineer Taichung, TXG, TW 2020/7/16
Taichung, TXG, TW 2020/7/16
GLOBAL FE PLN MODELING ENGINEER (ANALYTICS)
GLOBAL FE PLN MODELING ENGINEER (ANALYTICS) Singapore, 03, SG 2020/7/16
Singapore, 03, SG 2020/7/16
Director Data Science
Director Data Science San Jose, CA, US 2020/7/16
San Jose, CA, US 2020/7/16
(Sr.) Field Application Engineer- ODM -System (Taipei) Taipei, TPE, TW 2020/7/16
MTB 3DI PWF CMP Equipment Engineer 1
MTB 3DI PWF CMP Equipment Engineer 1 TAICHUNG, TXG, TW 2020/7/16
TAICHUNG, TXG, TW 2020/7/16
Engineer Scribe CAD
Engineer Scribe CAD Hyderabad, AP, IN 2020/7/16
Hyderabad, AP, IN 2020/7/16
Director, Customer Quality Engineering - SSD/mNAND Shanghai, 31, CN 2020/7/16
3DI PWF EQUIPMENT SHIFT ENGINEER
3DI PWF EQUIPMENT SHIFT ENGINEER Taichung, TXG, TW 2020/7/16
Taichung, TXG, TW 2020/7/16
VP, MTB
VP, MTB Taichung, TXG, TW 2020/7/15
Taichung, TXG, TW 2020/7/15
Advanced Packaging Integration Sr. Manager
Advanced Packaging Integration Sr. Manager Taichung, TXG, TW 2020/7/15
Taichung, TXG, TW 2020/7/15
Senior Scribe Layout & Design Engineer - Technology Development Hyderabad, AP, IN 2020/7/15
Sr Engineer, Quality Engineering (Risk Change Management) Penang, 07, MY 2020/7/15
Senior CMOS Device Development Engineer
Senior CMOS Device Development Engineer Boise, ID, US 2020/7/15
Boise, ID, US 2020/7/15
Senior IC Design Engineer
Senior IC Design Engineer Shanghai, 31, CN 2020/7/15
Shanghai, 31, CN 2020/7/15
3DxP Senior Product Engineer
3DxP Senior Product Engineer Boise, ID, US 2020/7/15
Boise, ID, US 2020/7/15
DATA SCIENCE ENGINEER - SMART MFG & AI 1
DATA SCIENCE ENGINEER - SMART MFG & AI 1 Singapore, 03, SG 2020/7/15
Singapore, 03, SG 2020/7/15
Senior R&D CMOS Device Integration Engineer Boise, ID, US 2020/7/15
DRAM System Engineer
DRAM System Engineer Taichung, TXG, TW 2020/7/15
Taichung, TXG, TW 2020/7/15
NAND Memory Cell Development Engineer
NAND Memory Cell Development Engineer Vimercate, MB, IT 2020/7/15
Vimercate, MB, IT 2020/7/15