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Date: Apr 8, 2018

Location: Taichung, TXG, TW

Company: Micron


Req. ID: 103444 

As 3DS Manager– APTD, you will be responsible for building and leading a team of engineers to develop advanced packaging process and equipment solutions for TSV Memory products at Micron’s new Taiwan manufacturing assembly site (MTB); you will need to have a deep understanding of packaging requirements, process capability, current state of equipment capability throughout the industry and the ability to incorporate best engineering practices for all backend assembly process; including but not limited to De-bond through Assembly Complete.

 Provide process packaging solutions on time to meet company and customer needs 

  • Work with cross-functional Global teams to roadmap future capabilities needed for packaging solutions
  • Engage across a broad group of internal and external customers on Package Development, Performance and Qualification requirements, as well as Test Chip and Product Planning to help define program timelines and enablement requirements
  • Work with Internal teams to put in place new capabilities to meet timelines
  • Work with suppliers on new packaging technology / material / capability / equipment requirement
  • Work with Process and Equipment counterparts in manufacturing on new equipment benchmarking
  • Key member in driving KEG (Key Equipment Group) and KMG (Key Material Group) programs to maintain strong working relationship with key suppliers

Ensure smooth transition from new process development, qualification, small volume production to high volume

  • Lead a team of Engineers and Eng Assistants in the development and Qualification of new packaging process and equipment solutions to meet Business Unit requirements
  • At initial transfer foster an environment where development and manufacturing teams are closely linked for pilot production input and process validation leading to successful High Volume
  • Startup pilot line for new packages and work on yield improvement activities for initial production volume run
  • Provide proper Documentation for product transfer to manufacturing
  • Understand the capabilities of the internal sites and work with the Global team on packaging solutions that will be transferable while leveraging advances

 Technical Leadership

  • Understand the future trend, technology and capabilities required for future packaging solutions
  • Provide general packaging leadership and strategy to influence Micron’s technical direction
  • Work with Internal teams to put in place new capabilities to meet future needs
  • Foster an environment of innovation to enable novel processes

 Manage People and Develop Careers of the Section Team Members 

  • Manage a team of engineers and engineering assistants
  • Foster a vibrant, energetic work environment, with a sense of urgency
  • Provide training and career development for engineers and engineering assistants

 Supervise Technical Publication and Patent Disclosure 

  • Supervise and encourage engineers and engineering assistants in publishing technical papers and patent disclosure submission

 Ensure a Safe, Compliant, and Ethical Work Environment

  • Maintain knowledge of, and apply, company safety, labor, and ethics policies
  • Communicate requirements and expectations to leaders and external stakeholders
  • Identify, resolve and / or report potential safety, security, and labor issues




  • Master’s Degree or Equivalent Work Experience Required


  • 7+ years’ engineering and leadership experience in semiconductor industry including 5+ years of successful management experience within a development environment
  • Experience and technical knowledge with die and wafer level process and equipment
  • An understanding of Micron’s silicon and how it interacts at a package level through CPI is a plus
  • Proven track record in motivating teams and fostering teamwork through clear and open communication
  • Leadership and strategic planning capability
  • Strong project management skills to ensure execution to timelines
  • Understanding of business needs and customers’ requirement
  • Ability to cooperate with people of different levels inside/ outside the company
  • Ability to empower others to achieve results through motivation, recognition and performance feedback
  • Strong negotiation and collaboration skills
  • Excellent English skill both in Oral and Written
  • Periodic international travel is required


  • International if required

Hiring Manager

  • TSV packaging developmentdirector MTB  

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Technology Development || Experienced || Regular || Engineering || Not Applicable ||

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