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Sr. Characterization Electrical Engineer-Advanced Packaging Technology Development

Date: Jan 13, 2018

Location: Taichung, TXG, TW

Company: Micron


Req. ID: 100323 


As a Sr. Characterization Electrical Engineer-Advanced Packaging Technology Development you will coordinate electrical failure analysis of memory packages, test vehicles, and material characterization test vehicles to support development efforts for DRAM and NAND packaging.  You will review and summarize lab characterization and production test data.  You will develop new electrical characterization methods for advanced materials and package technology concepts that will be adopted globally.  You will provide recommendations for test structure and test vehicle design.  Close collaboration with multiple engineering teams including materials engineering, package design, signal integrity, product engineering, test engineering, etc. is required. 



  • Coordinate electrical failures analysis to direct physical failure analysis of engineering reliability experiments
  • Develop new bench test methods as needed for evaluation of memory packages and test vehicles
  • Recommend and select bench test equipment for test structures, test vehicles, and test packages
  • Coordinate design of interface boards and hardware as needed for measuring insulation resistance of materials and low level resistance of interconnects
  • Develop substrate impedance test coupons and test methods that will be used globally by all sites and suppliers for monitoring substrate quality
  • Define characterization plans for new packaging technologies taking into account chip-package-interaction (CPI) effects
  •  Establish fault isolation protocols with TDR and other fault isolation tools to provide direction to physical failure analysis staff
  • Summarize production and lab characterization data to provide recommendations for development projects
  • APTD global point of contact for coordinating additional electrical characterization testing with other sites and external labs
  • Drive useful life modeling of failure mechanisms in the expected application environments based on known acceleration model algorithms and experimentally derive physical constants as needed for primary material related wear-out failure mechanisms
  • Participate in technology risk assessments for new packages and packaging technologies and provide recommendations to mitigate risk profile
  • Assist in resolve packaging material related qualification and production issues


Successful candidates must have:

  • Detailed understanding of methods used in semiconductor packaging for substrate impedance testing, high resistance testing, in-situ fault monitoring with event detectors, non-destructive defect identification and fault isolation tools
  • Familiarity with device package interactions with knowledge of BEOL/FEOL failure mechanisms due to packaging
  • Strong data analysis, SPC, DOE skills with knowledge of sampling statistics, reliability modeling, and reliability data analysis
  • Excellent problem solving and analytical skills
  • Good communication skills (verbal and written)


Degree required:

  • MS or equivalent


Academic Discipline(s):

  • Electrical Engineering, Electronics, Computer Engineering, or related discipline preferred


Experience Required:

10 years minimum preferred with BS or 5 years with advanced degree

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Backend Manufacturing || Experienced || Regular || Engineering || Not Applicable ||

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