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Senior Bond Wire and Solder Alloy Materials Engineer

Date: Jan 13, 2018

Location: Taichung, TXG, TW

Company: Micron

 

Req. ID: 100325 

As a Senior Bond Wire and Solder Alloy Materials Engineer you will develop and characterize packaging materials for advanced packaging technologies to ensure manufacturability, quality and reliability targets are met.  Key focus will be on materials to enable NAND and DRAM memory package devlopment.  You will be responsible for creating material technical roadmaps.  You will be responsible for coordinating assembly of materials test vehicles for testing and evaluating results to provide recommendations for materials specifications and process limits, as necessary.  Close collaboration with multiple engineering teams in development, process, design, and quality is required. 

 

Responsibilities:

  • Create and maintain material technical roadmaps for communication internally and externally
  • Identify and introduce materials for new package construction, process, yield and reliability improvement
  • Coordinate characterization testing to gather data to ensure materials & processing interaction effects are accounted for when integrating materials with packaging technology
  • Document critical to function properties for incorporation into controlled design documents, procurement specifications, and supplier PFMEA/QCP
  • Define material characterization plans for new packaging technologies taking into account chip-package-interaction (CPI) effects
  • Document primary material related package wear-out failure modes and failure mechanisms under various stress conditions to ensure characterization testing covers intrinsic reliability performance
  • Drive useful life modeling of failure mechanisms in the expected application environments based on known acceleration model algorithms and experimentally derive physical constants as needed for primary material related wear-out failure mechanisms
  • Participate in on-site technical assessments of suppliers as needed and provide technical input to internal business partners on supplier ratings & sourcing strategies; representing APTD on the key material groups (KMG) used for establishing global strategies for Substrates or Polymer Materials or Interconnect Materials
  • Participate in technology risk assessments for new packages and packaging technologies and provide recommendations to mitigate risk profile
  • Participate in engineering teams to evaluate new material and develop process for the new material and new package construction, and integrate the material into final product
  • Resolve packaging material related qualification and production issues using package failure analysis techniques

Successful candidates must have:

  • Demonstrated knowledge in bond wire and BGA solder ball alloy materials, fabrication technology, and supplier assessments
  • Experience in bond wire and BGA solder alloy materials characterization testing
  • Knowledge of material related failure mechanisms, chip-package interactions, reliability testing, and reliability modeling is preferred
  • Understanding of IATF16948 requirements and ability to critically assess supplier health in areas such as APQP, PFMEA, QCP, MSA, & PPAP. 
  • Excellent problem solving and analytical skills
  • Detailed understanding of physical failure analysis methods
  • Strong data analysis, SPC, DOE skills
  • Strong communication skills (verbal and written)
  • Process auditing experience is preferred

 

Minimum Degree required:

  • MS or equivalent

 

Academic Discipline(s):

  • Materials Engineering, Metallurgical Engineering

 

Experience Required:

  • Minimum 5 years with advanced degree, >10 years experience preferred


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.


Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.


To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).


Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Backend Manufacturing || Experienced || Regular || Engineering || Not Applicable ||
 


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