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Senior/Principal wafer lamination/de-bond engineer - ADVANCED PACKAGE DEVELOPMENT

Date: Apr 7, 2018

Location: Taichung, TXG, TW

Company: Micron


Req. ID: 99870 

Micron currently has an opening for a 3Di Package Development Engineer in the Advanced Packaging Technology Development organization located in Taichung. The engineer is responsible for developing, characterizing, and transferring process solutions for 3D-Interconnect (3DI) Package.  Major responsibilities in this role includes development and characterization of wafer mount, De-bond and NCF lamination processes for 3Di products. The engineer needs to insure the development and implementation of thin wafer for 3Di parts. You will be responsible for engaging with internal Pilot/HVM manufacturing teams as well as external equipment to drive process and tool solutions.  Other major responsibilities include process maturity and characterization activities and involvement with the deployment of processes and equipment to Pilot and HVM manufacturing facilities. You will be a part of the 3DI process team

dedicated to vertical stacked memory die and innovative products for Micron’s memory solutions


1. Job function


- New process development engineering in De-Bond and NCF lamination technology for packaging application.

- Improvement work in process and equipment in cooperation with production team.

- Team work with product integration, manufacturing and facility supporting teams.


2. Qualifications:

• Minimum of 5 years' experience in IC Package development

• Experience with EVG or TEL De-bonder; Lintec film laminator background

• Experience working with or in OSATs is a plus

• Knowledge of conventional 3Di packaging solution

• Knowledge of substrate technology and packaging materials

• Knowledge of package reliability and failure modes

• Strong interpersonal and communication skill

• Strong motivation in patient writing and know how path finding

• Professional management and team building capability

• Fluent English command is needed; Chinese-language skills a plus


3. Education:

• B.S. in - Mechanical, Electrical, Materials, Metallurgy, Physics or Chemistry, M.S preferred or Equivalent work experience in IC packaging




We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Technology Development || Experienced || Regular || Engineering || Not Applicable ||

Job Segment: Package Design, Materials Science, Metallurgy, Manufacturing Engineer, Manufacturing, Science, Engineering