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Date: Oct 8, 2017

Location: Taichung, TXG, TW

Company: Micron


Req. ID: 85815 

1. Job function


- New process development engineering in molding technology for mobile memory packaging application.

- Improvement work in process and equipment in cooperation with production team.

- Team work with product integration, manufacturing and facility supporting teams.


2. Qualifications:

• Minimum of 7 years' experience in IC Package development; mobile memory experience is preferred

• Experience with wafer level compression molding background is required

• Experience working with or in OSATs is a plus

• Knowledge of conventional wiring bonding packaging solution

• Knowledge of substrate technology and packaging materials

• Knowledge of package reliability and failure modes

• Strong interpersonal and communication skill

• Strong motivation in patient writing and know how path finding

• Professional management and team building capability

• Fluent English command is needed; Chinese-language skills a plus

• Ability to work in Taiwan


3. Education:

• B.S. in - Mechanical, Electrical, Materials, Metallurgy, Physics or Chemistry, M.S preferred or Equivalent work experience in IC packaging



We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Technology Development || Experienced || Regular || Engineering || Not Applicable ||

Job Segment: Materials Science, Metallurgy, Engineer, Electrical, Manufacturing, Science, Engineering