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Date: Apr 12, 2018

Location: Taichung City, TXG, TW

Company: Micron


Req. ID: 107262 

Job Description

As a Package Design Engineer at Micron Technology, Inc., you will be responsible for facilitating package design review meetings with the Taiwan assembly Development, NPI, and MFG teams. You will provide local support for site specific drawings and substrate vendor approval process as requested.  You will gather site input to support a technical risk assessment process that occurs during feasibility and design stages. You will also be responsible for facilitating a cross functional DFMEA meeting that reviews and ranks all remaining package risks at design close.   You will then manage and document DFMEA risk mitigation action items until they are closed.  You will drive alignment to the global package design and quality management system procedures. In this position, you will also represent the package design team in ISO/TS certification audits.


Primary Responsibilities and Tasks


Facilitate package design reviews

  • Explain package design procedures and documentation as needed
  • Review package construction, substrate design, and required manufacturing steps
  • Highlight aggressive design rules
  • Facilitate an in-depth discussion to highlight potential risks
  • Ensure all known design, materials, and manufacturing risks are documented


Facilitate Cross-Functional DFMEA meetings

  • Establish a cross-functional DFMEA team
  • Drive toward team consensus of required actions to mitigate risks
  • Document and manage risk mitigation action items
  • Document and maintain lessons learned
  • Monitor risk mitigation data and determine if design rule values can be improved
  • Report to package design management team on the effectiveness of the quality system (KPI's)





Bachelor Degree or equivalent experience

  • Mechanical / Electrical Engineering
  • Manufacturing / Industrial Engineer
  • Quality Systems Engineer
  • Materials Engineer


Desired Experience

  • 3 years of experience in the following:
  • Semi-conductor package design/development/manufacturing
  • Experience facilitating FMEA’s and maintaining ISO/TS Certification for semiconductor packaging



  • Proficient in speaking and writing English and Taiwanese
  • Ability to lead collaborative efforts through cross-functional teams
  • Strong organizational and leadership skills
  • Proficient computer skills



  • International travel may be required on a quarterly basis for training/global alignment
  • Work environment will be office (cubical)
  • Shift will be 8+ hour shift, 5 days per week, Days

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Taichung City || Taichung City (TW-TXG) || Taiwan (TW) || Technology Development || Experienced || Regular || Engineering || Not Applicable ||

Job Segment: Package Design, Semiconductor, Manufacturing Engineer, Engineer, Construction, Manufacturing, Science, Engineering