Email similar jobs to meEmail similar jobs to me
Share this Job

Senior APTD PWF Process Integration Engineer

Date: Apr 13, 2018

Location: Taichung City, TXG, TW

Company: Micron

 

Req. ID: 114861 

Micron currently has an opening for a wafer level packaging process integration engineer in the technology development organization located in Taichung. As a process integration engineer you will be part of the PI group responsible for driving the development and introduction of new process solutions to the 3D-Internect (3Di) technology that will be implemented in new advanced stacked DRAM memory products and subsequent improvement in yield and product quality to in order to prepare for its transfer to manufacturing.  In this role, responsibilities include, but not limited to, the following:

•Own the post wafer finish portion of product manufacturing process flow during development of new product introduction (NPI)

•Work closely in conjunction with the development process team to:

  • Develop and ensure processes can meet new product physical, electrical, and reliability specifications
  • Characterize module to module interactions
  • Improve process control, improve yields, and optimize process flow for best product performance, highest quality at lowest cost.

•Set up experiments using DOE, monitoring progress of changes, and statistical analysis of results

•Maintain or create detailed documentation of product/process information including lessons learned, module characterizations, risk assessment, etc.

•Work closely with inline defect detection, yield enhancement, product engineering, quality and reliability, and probe/test groups.

•Work closely with the NPI team on meeting product milestone dates

•Work with the manufacturing team to facilitate transfer

•Use project management skills to ensure timely completion of projects

•Publish module updates, key project status updates, best known methods, and lessons learned

 

Qualifications:

•Strong written and verbal communication skills

•Effective priority-setting

•The ability to effectively drive small teams

•Self-motivated with strong problem solving and analytical skills

•Understanding and knowledge of wafer level packaging process flows and unit processes

•Knowledge and experience with creating experiments using DOE, monitoring progress of changes, and using statistical methods to perform data analysis

•Knowledge and experience with statistical process control (SPC)

•Knowledge of Failure Modes and Effects Analysis (FMEA)

•Understanding of inline defect detection and failure analysis techniques.

•Understanding of package level process reliability

•Understanding of problem solving methodologies such as Kepner-Tregoe and Six Sigma

•Knowledge in various wafer level packaging metrology, inspection, and test methods

•Understanding of the new product introduction process

•Preferred experience with yield and defect improvement activity in a process integration engineer capacity.

•Ability to facilitate groups and meeting requirements

•Fluent English command is needed; Chinese-language skills a plus

•Ability to work in Taiwan

 

Education:

•      Masters degree in Chemical Engineering, Chemistry, Materials Science and Engineering, or related discipline is required

•      A B.S. degree with 5+ years of industry experience in Semiconductor Process Engineering will be considered

•      GJS: E4-E5


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.


Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.


To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).


Keywords:  Taichung City || Taichung City (TW-TXG) || Taiwan (TW) || Technology Development || Experienced || Regular || Engineering || Not Applicable ||
 


Job Segment: Process Engineer, Semiconductor, Manufacturing Engineer, Engineer, Electrical, Engineering, Science