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Date: Apr 13, 2018

Location: Shanghai, 31, CN

Company: Micron

Job Description                              

Application Engineer

The candidate will work closely with local system engineers and field application engineers to provide integrated solutions of Micron EBU (Embedded Business Unit) products to customers in APAC region.

Embedded business is responsible for automotive, ADAS, IOT and other many booming applications in Micron. APAC is one of the hot battle field where many memory system designs and innovations occur.

EBU APAC engineering team is responsible for supporting APAC based customers from chipset vendors, tier1 and local customers. This team is also very key for developing solutions and bringing up capabilities, such as tooling and platform development for pathfinding and field support, enabling new customer service, usage model analysis, etc.

He/she will drive customer design-in/design-win experience and respond customers escalated requests from technical point of view. He/she is expected to be able to use extensive memory and system technical knowledge to guide decisions and strategies for a project. He/she is responsible for customer technical communication, technical training, usage model collection and technical collaterals &tools development. He/she needs to build up strong teamwork with Micron engineering and customer R&D for excellent customer support and furthermore provides inputs to team members and managers on project, technical issues or innovation.

His/her responsibilities would include but not limited in below

  • Understand customer requirements and our product definition, collect customer usage model & qual flow and application intelligence, competitor intelligence though experiments and data compilation.
  • Provide inputs for technical gaps and solutions, work out collaterals/tools for product launching.
  • Co-work with customers on system design from beginning, positioning and troubleshooting, focus on leading product launch and door open projects.
  • Engaged with other Micron teams for customer enablement, platform enablement and solution developments.
  • 2nd level field technical support for customers including trainings, design in/design-win and production issues with quality team.

Education and Qualifications:

  • B.S./M.S. degree in Electrical Engineering, Computer Science or other equivalent majors.
  • 3+ years of application related or memory product R&D experience is strong plus.
  • Interested on learning modern technologies and delivering solutions, including emmc, 3D NAND TLC, NVMe, etc.
  • Linux BSP/other embedded system development experience is preferred.
  • Certain presentation and communication skill is desired.
  • Innovative, able to work under pressure, tenacity on problem solving are more than welcome characters.

Travelling to our customers locations and other Micron locations will be required.

Relocation Level: No 

Hiring Manager: ANDREW DONG 

Recruiter: MELISSA LU 

Job Segment: Application Engineering, R&D Engineer, Engineer, Electrical, Computer Science, Engineering, Technology