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Date: Sep 21, 2017

Location: Muar, 01, MY

Company: Micron

 

Req. ID: 94126 

Job description

As MMY Wire Bond Process Engineer at Micron, you are resposible :

  • Addressing and improve product and equipment -specific issues relates to Wire Bond Process 
  • Collaborating with other Assembly Engineering teams to implement new products and monitor existing products.
  • Serve as the Wire Bond process primary point of contact for product-specific engineering issues and acts as a liaison with outside departments including FAB, Probe, PE, Test, QA, EI and Planning.
  • Liaised with QA group for quality improvement specifically for Wire Bond process by introducing efficient working method, safety working environment, line audit, equipment health check and process and equipment improvement.you need support on the process development, investigate manufacturing issues related to Probe, Test processes and Equipment.
  • Identify and implement solutions, communicate with suppliers, peers and customers to accurately relay technical information, mentoring other, and EHSS.
  • Participate in identify and/or manage specific project roadmaps (as required) in Wire Bond process
  • Participate and contribute in risk analysis process, as required relates to Wire Bonding process
  • Manage or participate in cross functional or cross department projects and/or teams
  • Develop and implement long term improvements in equipment or processes that reduce scrap, cost, rework, cycle time, aid throughput, or provide yield improvement
  • Use data analysis, mathematical modeling, and metrology tools
  • Generate process specifications and control limits based on test data analysis
  • Conduct new equipment modifications and process research
  • Identify and evaluate interactions between equipment, processes and resolve potential issues
  • Identify and implement Wire Bond equipment process control methods (training, APC, and reaction mechanisms)
  • Standardize Wire Bond methods and procedures across areas, departments, and sites as appropriate
  • Monitor Bond assemby SPC tools - equipment & sofware as a system control for MMY
  • Monitor & Implement Wire Bond process working procedures, process specification, FMEA and OCAP for line personnel

 

Requirements

  • Degree in Mechanical, Mechatronics, Electrical & Electronics Engineering.
  • Minimum 1-2 years working experience in Semiconductor Industry.
  • Knowledge in Wire Bond process & equipment shall be added advantage.
  • Excellent interpersonal, communication skills and hands on capability with an extremely positive attitude towards working
  • As a team and continuous improvement.
  • Able to work under pressure.


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.


Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.


To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).


Keywords:  Muar || Johor (MY-01) || Malaysia (MY) || Backend Manufacturing || College || Regular || Engineering || *LI-SING  ||
 


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