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Intern_Engineering Process 3

Date: Mar 9, 2018

Location: Muar, 01, MY

Company: Micron


Req. ID: 114086 

Project Title

Wafer thickness process capability improvement.


Project Description

  • Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC). A number of manufacturing challenges exist for these processes as technology is growing where are wafer thickess become thin less then 50um. This project will be focused on the process stability and improve on the process capability (Cpk) by minimize the machine to machine variation.
  • At the end of this project, student / intern will understand the wafer backgrinding process for thin wafer. Student/intern also will be exposed to several analysis tools such as Why2 Analysis, JMP and SPC which is widely used across globaly in all semiconductor field.



Currently pursuing degree in Engineering of

  • Mechanical
  • Eletrical
  • Mechatronic

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Muar || Johor (MY-01) || Malaysia (MY) || Backend Manufacturing || Entry || Internship || Manufacturing/Production Operations || #LI-LT1 ||

Job Segment: Process Engineer, Semiconductor, Intern, Engineer, Fabrication, Engineering, Science, Entry Level, Manufacturing