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Intern_Engineering Process 2

Date: Mar 9, 2018

Location: Muar, 01, MY

Company: Micron


Req. ID: 114085 

Project Title

Wire Bond Looping optimization


Project Description

  • Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.  Gold wire is commonly used as a connecting material for its mouldability & conductivity characteristic. As technology is growing & developing, wires are getting thinner with chalenging shape. There are min 5 types of wire looping profile in wire bonding process in Micron Semiconductor Malaysia. This project focus to optimize & minimize changes of loop profile during setup while having best profile to ensure robust process parameter for High Volume Manufacturing.
  • At the end of this project, student / intern will understand looping type available in wire bond assembly process & know-how on loop shape details. This project will also help to the student / intern to understand how loop has becomes one of the critical items to minimize risk of setup failure during wire bond conversion.



Currently pursuing degree in Engineering of:

  • Mechanical
  • Material
  • Eletrical & Eletcronic

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Muar || Johor (MY-01) || Malaysia (MY) || Backend Manufacturing || Entry || Internship || Manufacturing/Production Operations || #LI-LT1 ||

Job Segment: Process Engineer, Semiconductor, Intern, Engineer, Fabrication, Engineering, Science, Entry Level, Manufacturing