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Intern_Engineering Process 1

Date: Mar 9, 2018

Location: Muar, 01, MY

Company: Micron


Req. ID: 114084 

Project Title

Die-Attach film (DAF) adhesive life span control study


Project Description

Die-Attach film (DAF) adhesive has become popular and mandatory when stack chips are used to accomplish larger capacity in 3-D packaging of flash memory devices. Thus the DAF life span control during the assembly process are critical as the tape properties are change due to difference factor (example: environment , cycle time , temperature & etc).
At the end of this project, he/she can understand more about tape characteristics, properties toward difference factor impact and also understand the assembly process flow with basic Die Attach process knowledge.



Currently pursuing degree in Material Engineering.

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Muar || Johor (MY-01) || Malaysia (MY) || Backend Manufacturing || Entry || Internship || Manufacturing/Production Operations || #LI-LT1 ||

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