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R&D Thin Films Materials Technology Engineer

Date: Apr 8, 2018

Location: Boise, ID, US

Company: Micron

Req Id: 106962 

As a Thin Films Materials Technology Engineer you will be working on advanced spin-on polymeric or CVD deposited materials for electrical isolation in integrated semiconductor circuits. A good understanding of materials’ mechanical properties at nanoscale is required for this job. In addition, understanding of one or all of following topics is a plus for this position.

  • Micro- and/or nano-mechanical structures

  • Thin film linear and non-linear mechanical behaviors

  • Fluid-structure interactions and modeling

  • Ability to use Stoney’s equation and various solid mechanics (e.g., composite plate and beam) to explain residual stresses, deformations, and shrinkage in deposited thin films.


You will contribute at a high level as part of diffusion/RTP technology team to develop production-worthy, low cost processes, including LPCVD, ALD, diffusion, oxidations, RTP, and advanced anneals.  You can expect to provide ownership for both process development & related tool issues for specific films/processes.  You will be responsible for incorporating these processes into corresponding process flow for application in high density DRAM, FLASH and advanced memory parts.


Successful candidate for this position will have:

  • Previous industry experience (Preferred).

  • The ability to work with a wide variety of people in different areas of R&D process integration, process development, and pilot production to effectively accomplish tasks in a timely manner.

  • The ability to plan and execute effective, well-designed experiments and write clear, concise reports documenting the results.

  • The ability to suggest process alternatives and evaluate different options that may provide improved film properties and higher process margins.

  • An understanding of the interactions between process and hardware and be able to leverage this knowledge.

  • The ability to give and take constructive criticism from other team members and be able to leverage input to drive projects forward.

  • An understanding of chemical kinetics and their direct application to diffusion, CVD, and ALD deposition processes in various deposition reactors.

  • An understanding of various types of physical film analysis techniques such as SIMS, XPS, EDS, SEM, TEM, RBS, EPMA, SE.

  • An understanding of various thin film electrical evaluation methods and techniques such as leakage, impedance, capacitance.

  • An understanding of the various integration/structural impacts and constraints related to oxidation, nitridation, and anneal processes in memory devices.

  • The ability to evaluate and make insightful inferences from large amounts of various types of data, such as physical & electrical analysis.

  • The ability to interact and collaborate with integration engineers to develop robust film and related module as well as deploy the process to internal customers in R&D and the production fabs.

  • The ability to analyze oxide quality using CV methods, mercury probe methods, Quantox, SDI, probe data and reliability data (TDDB).

  • Familiarity with MOSCAP device flow and electrical analysis techniques and data interpretation.

  • Full understanding of chemistry/physics of oxidation processes, including stoichiometry, interface effects, defect/trap formation and engineering.

  • The ability to be a self-motivated team player and be adaptable to Micron's changing needs including working extended hours if required.

  • A high degree of motivation, goal orientation and possess the ability to aggressively focus on solving problems both as part of a team and individually.

  • Excellent verbal and written communication skills are required to be effective.

  • The ability to manage projects effectively making best use of available resources.

  • Demonstrated to be dependable and willing to take responsibility for the development of a process and tool.

  • The ability to learn new skills as needed.

  • 3 years experience or related graduate work.



Ph.D. in Chemical Engineering, Materials Science, Physics, Chemistry, Electrical Engineering, Mechnical Engineering or similar field or MS with extensive thin film process experience may substitute for Ph.D.


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.
Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.
To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).
Keywords: Boise || Idaho (US-ID) || United States (US) || Technology Development || Experienced || Regular || Engineering || #LI-MT1 || #LI-MT1


Nearest Major Market: Boise
Nearest Secondary Market: Meridian

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