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R&D Advanced Memory Thin Films Development Engineer

Date: Jan 8, 2018

Location: Boise, ID, US

Company: Micron

Req Id: 106330 

As an Advanced Memory Technology Thin Films Process Development Engineer at Micron Technology, Inc., you will contribute at a high level as part of process technology team to develop deep sub-micron generation production-worthy, low cost processes, including CVD/PECVD, ALD/PEALD, PVD, beamline implantation, and Plasma Immersion Implantation.  You will provide ownership for both process development & related tool issues for specific films/processes.  You will also be responsible for incorporating these processes into corresponding process flow for application in high density advanced memory parts.

 

Qualifications

 

Successful candidates for this position will have:

  • A minimum of 3 years experience or equivalence in Fab research and development, preferably with experience in thin films deposition on microelectronic devices.
  • The ability to work with a wide variety of people in different areas of R&D process, integration, and pilot line production to effectively accomplish tasks in a timely manner.
  • The ability to plan and execute effective, well-designed experiments and write clear, concise reports documenting the results.
  • The ability to suggest process alternatives and evaluate different options that may provide improved film properties and higher process margins.
  • The ability to give and take constructive criticism from other team members and be able to leverage input to drive projects forward.
  • An understanding of
    • Electronic material properties, thermal dynamics, chemical kinetics, plasma physics and chemistry, vacuum physics, and their direct application to thin films deposition processes in various deposition methods, including CVD/PECVD, ALD/PEALD, and PVD. Fundamental plasma processing and their impact on film properties. Statistical analysis, SPC/DOE. Thin films fundamentals and roles in all processing steps of forming memory devices, peripheral devices and their IC circuit. Fundamental challenges in material exploration for device scaling.
    • Various types of physical film analysis techniques such as SEM/EDS, TEM/EELS, XPS/AES, SIMS, RBS, ICP-GDMS, AFM, XRR, and XRD. Various thin film electrical evaluation methods and techniques.
  • Experience and knowledge of Fab metrology tools such as optical/electrical methods.
  • The ability to evaluate and make insightful inferences from large amounts of various types of data, such as physical & electrical analysis.
  • The ability to interact and collaborate with integration engineers to develop robust film and related module as well as deploy the process to internal customers in R&D and the production fabs.
  • The ability to be a self-motivated team player and be adaptable to Micron's changing needs including working extended hours if required.
  • The ability to be highly motivated and goal oriented.
  • The ability to aggressively focus on solving problems both as part of a team and individually. 
  • Excellent verbal and written communication skill.
  • The ability to manage projects effectively making best use of available resources.
  • Dependability and the willingness to take responsibility for the development of a process and tool.
  • The ability and willingness to learn new skills as needed.

 

Education:

Ph.D in Materials Science and Engineering, Chemical Engineering, Physics, Chemistry, Electrical Engineering or similar field. Extensive process development experience may substitute for Ph.D.

 

 

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.
 
Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.
 
To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).
 
Keywords: Boise || Idaho (US-ID) || United States (US) || Technology Development || Experienced || Regular || Engineering || *LI-DK1 ||

 


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