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Intern - Multiscale Modeling Engineer

Date: Dec 6, 2017

Location: Boise, ID, US

Company: Micron

Req Id: 92805 

Job Description:

As an engineering intern in the Technology Development group at Micron Technology, Inc., you will perform first-principles-based modeling of materials, processes, and devices. You will be responsible for the investigation of physical and chemical mechanisms that are associated with the incorporation of new materials, device physics, and chemistry, and its interaction with process parameters. You will primarily work with ab initio calculations of materials and chemicals to collaborate in the in-house development of understanding of material limits, process chemistry, and device physics by utilizing multi-scale (atomistic-continuum) modeling and simulations.


Required Qualifications:

- You should have completed graduate level courses/work projects that emphasize on computational modeling of materials/processes/structures, with a formal introduction to the theories in solid state and condensed matter including the electronic structure of bulk materials, grain boundaries, surfaces, interfaces, and thin films, as well as electron and phonon transport.

- Knowledge of techniques not limited to density functional theory (DFT), plane-wave approximations, local orbital approximations, and non-equilibrium Green’s function (NEGF).

- The position demands sound knowledge of numerical methods, Fortran/C/C++ programming, MPI processes and threading, PYTHON/Perl scripting languages, and Linux operating systems.


Desirable Qualifications:

- In addition the candidate should have the ability to perform atomistic scale modeling of surface kinetics.

- Functioning knowledge of MC, MD, Phase-field, R-Matrix, and FEA techniques.

- Basic understanding and background in modeling of molecular chemistry and building reaction mechanisms using ab initio methods.

- Experience in thin-film deposition and etch simulations relevant to ALD/PE-ALD, CVD/PE-CVD, ALE.

- Exposure to modeling of structural stress, mass transport, heat transfer, fluid flow, plasma physics, and feature profile simulations.

- Background in device physics modeling using DFT and NEGF techniques.

- Hands on experience with COMSOL, ANSYS, HPEM is a plus.



You must be currently enrolled and actively pursuing a graduate level degree (PhD) in good standing in one of the following disciplines: Physics/Materials Science/Chemical Engineering/Chemistry/Electrical Engineering or related discipline.

Must be continuing education in Fall of 2018 (expected graduation date must not be before September 1st 2018).



We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.
Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.
To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).
Keywords: Boise || Idaho (US-ID) || United States (US) || Technology Development || Entry || Internship || Engineering || *LI-MW1 ||


Nearest Major Market: Boise
Nearest Secondary Market: Meridian

Job Segment: Thermal Engineering, Intern, Engineer, Electrical, Chemical Engineer, Engineering, Entry Level