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Engineering Manager-IC Packaging/Mechanical Simulation

Date: Oct 12, 2017

Location: Boise, ID, US

Company: Micron

As a Simulation Engineering Manager in Micron's Advanced Packaging Technology Developmet Group, you will manage mechanical simulation and thermal simulation engineering efforts; establishing simulation engineering performance metrics, setting priorities, proposing validation studies, while coordinating development of simulation methods.  You will propose test structures, test vehicles, and test methods used to support materials, process, and product development efforts.  You will be familiar with the semiconductor package design, SMT design requirements, customer application requirements, and have a good understanding of 1st and 2nd level characterization methods.  Close collaboration with multiple engineering teams such as design, materials, process integration, process, quality assurance, and applications engineering is required.   



  • Manage a Simulation Engineering team and ensure team is globally aligned on BKM for simulation approach and test methods
  • Integrate Simulation Engineering into the Component Package Design process
  • Perform simulations to aid in establishment of design rules, materials selection, and assess risk of new packages
  • Develop BEOL chip-package-interaction simulation support team, propose test structures and concepts as needed to support technology pathfinding, materials & process development, and package design development efforts
  • Support efforts to validate package design rules, scribe design rules, BEOL design rules, module/SSD design rules, etc. and collaborate with the appropriate design teams as needed
  • Provide simulation support for customer application integration and problem solving efforts
  • Collaborate with Materials Engineering to define material property requirements; propose test structures, test methods, and provide guidance to ensure materials are characterized for modeling needs


Successful candidates must have:

  • Knowledge of thermal and mechanical finite FEA/CFD simulation software tools and simulation methods used for semiconductor packaging and board level applications
  • Understanding of test methods used to determine thermal, mechanical, and viscoelastic properties of materials
  • Strong understanding of material properties
  • Experience with electronic packaging materials
  • Excellent problem solving and analytical skills
  • Strong communication skills


Degree required:

  • BS minimum, MS or higher preferred


Academic Discipline(s):

  • Mechanical Engineering, Material Science Engineering or a related discipline is a preferred


Experience Required:

10 years minimum experienced in semiconductor packaging and 5 years management experience preferred

It has been and will continue to be the policy of Micron to administer all human resource actions and benefits without regard to race, religion, color, sex, national origin, age, disability, sexual orientation, veteran's or other legally-protected status. Each manager, supervisor, and team member is responsible for carrying out this policy.

The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters. To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords: Boise || Idaho (US-ID) || United States (US) || Technology Development || Experienced || Regular || Engineering || *LI-DK1 ||

Nearest Major Market: Boise
Nearest Secondary Market: Meridian

Job Segment: Package Design, Semiconductor, Thermal Engineering, Engineer, Mechanical Engineer, Manufacturing, Science, Engineering